Transdermal sensing probes and smart patch systems using same

• US 10,638,945 B2
• Filed: 07/07/2016
• Issued: 05/05/2020
• Est. Priority Date: 12/21/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Dang, Bing, Liu, Yang, Wright, Steven L.
• Primary Examiner(s): Cazan, Livius R.
• Application Number:
  US15/203,869
• Publication Number:
  US 20170175280A1
• Time in Patent Office: 1,398 Days
• CPC Class Codes: A61B 2562/0215 Silver or silver chloride containing
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/0022 Monitoring a patient using a global network, e.g. telephone networks, internet
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: A61B 5/6839 Anchoring means, e.g. barbs
• CPC Class Codes: A61N 1/0492 Patch electrodes A61N1/0412, A61N1/0428 take precedence
• CPC Class Codes: A61N 1/0502 Skin piercing electrodes
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G16H 40/67 for remote operation

Abstract

An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

Claims

1. A method, comprising:

forming a plurality of pits in an array on a first substrate, the pits having a pyramidal shape;

forming a release layer on the first substrate and covering surfaces of the plurality of pits;

forming in the pits probe tips on the first substrate, the probe tips formed from rigid conductive material;

forming a plurality of pillars from rigid conductive material, wherein a probe comprises a pillar and a probe tip together forming a transdermal anchor structure;

forming a plurality of pads within a second substrate;

electrically and mechanically connecting the plurality of pillars to the second substrate, wherein a bottom surface of the second substrate mates with top surfaces of the pillars at the pads of the second substrate providing electrical and physical connections between the second substrate and the pillars;

wherein the pads reside within the second substrate and have a surface that is flush with the bottom surface of the second substrate at a point of contact of the top surfaces of the pillars and the bottom surface of the second substrate;

forming a plurality of vias in the second substrate that are unfilled or filled with breathable material;

electrically and mechanically connecting the plurality of pillars to the plurality of probe tips; and

causing release of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes configured as a transdermal smart patch;

wherein the transdermal smart patch comprises circuitry to sense bio-electrical signals and/or provide stimulation via the array of rigid and conductive probes.

2. The method of claim 1, wherein:

forming a plurality of pillars from rigid conductive material and electrically and mechanically connecting the plurality of pillars to a first substrate further comprise forming the pillars on corresponding ones of the probe tips, one pillar per probe tip, wherein forming the pillars on corresponding ones of the probe tips also electrically and mechanically connects the plurality of pillars to the first substrate; and

electrically and mechanically connecting the plurality of pillars to the second substrate further comprises electrically and mechanically connecting the plurality of pillars to the second substrate using one of a solder layer or a conductive adhesive to bond the second substrate and the plurality of the pillars, wherein electrically and mechanically connecting the plurality of pillars to the second substrate is performed after forming the plurality of pillars.

3. The method of claim 2, wherein forming the pillars further comprises forming the pillars using lithographic and etching techniques.

4. The method of claim 1, wherein forming in the pits probe tips on the first substrate further comprises forming in the pits the probe tips such that a surface of the probe tips aligns with a surface of the first substrate.

5. The method of claim 1:

wherein the probe tips comprise a vertex and a base;

wherein a junction where one of the plurality of pillars meets a probe tip is at the base;

wherein the width of the base is larger than the width of the pillar at the junction to form the transdermal anchor structure; and

wherein the probe tip comprises a recess within the base such that the junction is within the recess.

6. The method of claim 1, further comprising:

collecting the bio-electrical signals from the plurality of probes;

transmitting data corresponding to the signals to a remote device over one or more network interfaces;

wherein the remote device wirelessly transmits, via a wireless link, data corresponding to the signals to a server within a network;

wherein the server is configured to i) perform analysis of the data corresponding to the signals received from the transdermal smart patch; and

ii) provide access to the data corresponding to the signals to either a user to which the transdermal smart patch is applied, or a user administering the transdermal smart patch.