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Transdermal sensing probes and smart patch systems using same

  • US 10,638,945 B2
  • Filed: 07/07/2016
  • Issued: 05/05/2020
  • Est. Priority Date: 12/21/2015
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • forming a plurality of pits in an array on a first substrate, the pits having a pyramidal shape;

    forming a release layer on the first substrate and covering surfaces of the plurality of pits;

    forming in the pits probe tips on the first substrate, the probe tips formed from rigid conductive material;

    forming a plurality of pillars from rigid conductive material, wherein a probe comprises a pillar and a probe tip together forming a transdermal anchor structure;

    forming a plurality of pads within a second substrate;

    electrically and mechanically connecting the plurality of pillars to the second substrate, wherein a bottom surface of the second substrate mates with top surfaces of the pillars at the pads of the second substrate providing electrical and physical connections between the second substrate and the pillars;

    wherein the pads reside within the second substrate and have a surface that is flush with the bottom surface of the second substrate at a point of contact of the top surfaces of the pillars and the bottom surface of the second substrate;

    forming a plurality of vias in the second substrate that are unfilled or filled with breathable material;

    electrically and mechanically connecting the plurality of pillars to the plurality of probe tips; and

    causing release of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes configured as a transdermal smart patch;

    wherein the transdermal smart patch comprises circuitry to sense bio-electrical signals and/or provide stimulation via the array of rigid and conductive probes.

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