Ceramic-metal structure

• US 10,639,736 B2
• Filed: 07/14/2017
• Issued: 05/05/2020
• Est. Priority Date: 07/19/2016
• Status: Expired due to Fees

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Iwata, Muneyuki, Nagaya, Yoshiaki, Horio, Toshikazu, Yamamoto, Shigeyuki
• Primary Examiner(s): Thomas, Alexander S
• Application Number:
  US16/302,758
• Publication Number:
  US 20190126373A1
• Time in Patent Office: 1,026 Days
• CPC Class Codes: B23K 1/14 specially adapted for soldering seams making tubes involving operations other than soldering B21C
• CPC Class Codes: B23K 1/18 circumferential seams, e.g. of shells
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 2103/05 Stainless steel
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: C04B 2237/064 based on alumina or aluminates
• CPC Class Codes: C04B 2237/122 based on refractory metals
• CPC Class Codes: C04B 2237/124 based on copper
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/406 Iron, e.g. steel
• CPC Class Codes: C04B 2237/62 Forming laminates or joined articles comprising holes, channels or other types of openings
• CPC Class Codes: C04B 2237/68 Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
• CPC Class Codes: C04B 2237/72 Forming laminates or joined articles comprising at least two interlayers directly next to each other
• CPC Class Codes: C04B 2237/74 Forming laminates or joined articles comprising at least two different interlayers separated by a substrate
• CPC Class Codes: C04B 2237/765 at least one member being a tube
• CPC Class Codes: C04B 2237/80 Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
• CPC Class Codes: C04B 2237/86 Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
• CPC Class Codes: C04B 37/02 with metallic articles
• CPC Class Codes: C04B 37/023 characterised by the interlayer used C04B37/028 takes precedence
• CPC Class Codes: Y10T 428/218 : Aperture containing
• CPC Class Codes: Y10T 428/24331 : including nonapertured component

Abstract

A ceramic-metal structure in which a metallic body (2) is inserted into or disposed above a through hole (4h) of a ceramic substrate (4) and which includes an annular pad layer (6) disposed around the through hole; an annular ring member (8) joined to the pad layer via a first brazing filler portion (10) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion (12) intervening between the ring member and metallic body; and brazing filler flow prevention layers (7a, 7b) covering an outer surface of the pad layer so as to expose a central region (6c) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.

Claims

1. A ceramic-metal structure in which a pipe-shaped or rod-shaped metallic body is inserted into a through hole extending through a ceramic substrate from a surface of the ceramic substrate in a thickness direction thereof or is coaxially disposed just above the through hole,

the ceramic-metal structure comprising:

an annular pad layer made of a metal and disposed on the surface of the ceramic substrate to be located around the through hole;

an annular ring member joined to the pad layer via a first brazing filler portion and having a coefficient of thermal expansion smaller than that of the metallic body;

a second brazing filler portion intervening between the ring member and the metallic body and joining the ring member and the metallic body together; and

a brazing filler flow prevention layer which covers an outer surface of the pad layer in such a manner as to expose a central region of an upper surface of the outer surface of the pad layer, the upper surface facing the first brazing filler portion,

wherein the first brazing filler portion joins the central region and the ring member together without projecting to a radially inner side and a radially outer side of the brazing filler flow prevention layer.

2. A ceramic-metal structure according to claim 1, wherein the ring member has an outer diameter smaller than that of the pad layer, and the first brazing filler portion has a portion which is in contact with a peripheral surface of the ring member and forms a fillet shape.

3. A ceramic-metal structure according to claim 1, wherein the first brazing filler portion has a portion which extends toward a radially inner side of the ring member and forms a fillet shape.

4. A ceramic-metal structure according to claim 1, wherein the ceramic substrate and the brazing filler flow prevention layer contain the same material as their main components.

5. A ceramic-metal structure according to claim 1, wherein the ceramic substrate has a flow channel formed therein which is connected to the through hole and through which gas flows, the metallic body is pipe-shaped, and exchange of gas can be performed between the flow channel and the outside of the ceramic substrate through an internal space of the metallic body.