Cu core ball, solder joint, solder paste and formed solder

• US 10,639,749 B2
• Filed: 06/10/2019
• Issued: 05/05/2020
• Est. Priority Date: 06/12/2018
• Status: Active Grant

• Current Assignee: Senju Metal Industry Company Limited
• Original Assignee: Senju Metal Industry Company Limited
• Inventors: Kawasaki, Hiroyoshi, Kondoh, Shigeki, Sudo, Hiroki, Tsuchiya, Masato, Yashima, Takashi, Roppongi, Takahiro, Soma, Daisuke
• Primary Examiner(s): La Villa, Michael E.
• Application Number:
  US16/435,776
• Publication Number:
  US 20190375054A1
• Time in Patent Office: 330 Days
• CPC Class Codes: B22F 1/00 Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
• CPC Class Codes: B22F 1/065 Spherical particles
• CPC Class Codes: B22F 1/14 Treatment of metallic powder mixing with lubricating or binding agents or with organic material B22F1/10
• CPC Class Codes: B22F 1/142 Thermal or thermo-mechanical treatment
• CPC Class Codes: B22F 1/17 Metallic particles coated with metal
• CPC Class Codes: B23K 35/0227 Rods, wires B23K35/0244 takes precedence
• CPC Class Codes: B23K 35/0238 layered
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/302 Cu as the principal constituent
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: B23K 35/3046 Co as the principal constituent
• CPC Class Codes: B23K 35/3602 Carbonates, basic oxides or hydroxides
• CPC Class Codes: B23K 35/365 Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 15/043 of metal B32B15/01 takes precedence
• CPC Class Codes: C22C 13/00 Alloys based on tin
• CPC Class Codes: C22C 9/00 Alloys based on copper
• CPC Class Codes: C22C 9/02 : with tin as the next major constituent
• CPC Class Codes: C22C 9/06 : with nickel or cobalt as the next major constituent
• CPC Class Codes: C23C 28/00 : Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: C23C 28/02 : only coatings only including layers of metallic material
• CPC Class Codes: C23C 28/021 : including at least one metal alloy layer
• CPC Class Codes: C23C 28/023 : only coatings of metal elements only
• CPC Class Codes: C23C 30/00 : Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process C23C26/00, C23C28/00 take precedence
• CPC Class Codes: C23C 30/005 : on hard metal substrates
• CPC Class Codes: G01N 2021/95646 : Soldering
• CPC Class Codes: G01N 21/25 : Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
• CPC Class Codes: G01N 21/951 : Balls
• CPC Class Codes: G01N 21/95684 : Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: H01L 2224/13016 : in side view
• CPC Class Codes: H01L 2224/13582 : Two-layer coating
• CPC Class Codes: H01L 2224/13611 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13657 : Cobalt [Co] as principal constituent
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/20105 : Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K
• CPC Class Codes: Y10T 428/12014 : having metal particles
• CPC Class Codes: Y10T 428/12028 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
• CPC Class Codes: Y10T 428/12104 : Particles discontinuous
• CPC Class Codes: Y10T 428/12222 : Shaped configuration for melting [e.g., package, etc.]
• CPC Class Codes: Y10T 428/12229 : Intermediate article [e.g., blank, etc.]
• CPC Class Codes: Y10T 428/12493 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12708 : Sn-base component
• CPC Class Codes: Y10T 428/12715 : Next to Group IB metal-base component
• CPC Class Codes: Y10T 428/12722 : Next to Group VIII metal-base component
• CPC Class Codes: Y10T 428/12875 : Platinum group metal-base component
• CPC Class Codes: Y10T 428/12903 : Cu-base component
• CPC Class Codes: Y10T 428/1291 : Next to Co-, Cu-, or Ni-base component
• CPC Class Codes: Y10T 428/12917 : Next to Fe-base component
• CPC Class Codes: Y10T 428/12924 : Fe-base has 0.01-1.7% carbon [i.e., steel]
• CPC Class Codes: Y10T 428/12931 : Co-, Fe-, or Ni-base components, alternative to each other
• CPC Class Codes: Y10T 428/12937 : Co- or Ni-base component next to Fe-base component
• CPC Class Codes: Y10T 428/12944 : Ni-base component
• CPC Class Codes: Y10T 428/12993 : Surface feature [e.g., rough, mirror]
• CPC Class Codes: Y10T 428/2495 : Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/26 : Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/29 : Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
• CPC Class Codes: Y10T 428/2982 : Particulate matter [e.g., sphere, flake, etc.]
• CPC Class Codes: Y10T 428/2991 : Coated

Abstract

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 μm or more to 1000 μm or lower.

Claims

1. A Cu core ball comprising:

a Cu ball, and

one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from a group of Ni, Co, Fe and Pd,

wherein the Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 1.0 ppm by mass, and remainder of Cu and inevitable impurities,

wherein the Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher, and

wherein the Cu ball contains a diameter of 1 μ

m or more to 1000 μ

m or lower.

2. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.98 or higher.

3. The Cu core ball according to claim 1 wherein the sphericity thereof is 0.99 or higher.

4. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm² or lower.

5. The Cu core ball according to claim 1 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm² or lower.

6. The Cu core ball according to claim 1, further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher.

7. The Cu core ball according to claim 6 wherein the sphericity of the Cu core ball is 0.98 or higher.

8. The Cu core ball according to claim 6 wherein the sphericity of the Cu core ball is 0.99 or higher.

9. The Cu core ball according to claim 6 wherein the Cu core ball contains alpha dose which is 0.0200 cph/cm² or lower.

10. The Cu core ball according to claim 6 wherein the Cu core ball contains alpha dose which is 0.0010 cph/cm² or lower.

11. A solder joint formed from the Cu core ball according to claim 1.

12. The solder joint according to claim 11, the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher.

13. Solder paste comprising the Cu core ball according to claim 1.

14. The solder paste according to claim 13, the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher.

15. Formed solder comprising the Cu core ball according to claim 1.

16. The formed solder according to claim 15, the Cu core ball further containing a solder layer which covers a surface of the metal layer wherein the sphericity of the Cu core ball is 0.95 or higher.