Molding system with movable mold tool

• US 10,639,833 B2
• Filed: 03/29/2017
• Issued: 05/05/2020
• Est. Priority Date: 03/30/2016
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Chiang, Chau Fatt, Chung, Khar Foong
• Primary Examiner(s): Choudhry, Mohammad M
• Application Number:
  US15/472,721
• Publication Number:
  US 20170282426A1
• Time in Patent Office: 1,133 Days
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14336 Coating a portion of the article, e.g. the edge of the article B29C45/14573 and B29C45/14598 take precedence
• CPC Class Codes: B29C 45/1635 using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29C 45/1756 Handling of moulds or mould parts, e.g. mould exchanging means moulds per se B29C45/26
• CPC Class Codes: B29K 2105/0058 Liquid or visquous
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An apparatus for molding a physical body comprising at least two mold materials, wherein the apparatus comprises a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two mold materials, and a supply unit configured for separately supplying the at least two mold materials to the mold volume, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.

Claims

1. An apparatus for molding a physical body comprising at least two different mold materials, wherein the apparatus comprises:

a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two different mold materials, wherein the different mold materials have different physical properties;

a supply unit configured for separately supplying the at least two different mold materials to the mold volume one after the other;

wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.

2. The apparatus according to claim 1, wherein the first mold tool is stationary and the second mold tool is at least partially movable.

3. The apparatus according to claim 1, wherein the first mold tool is a bottom mold tool and the second mold tool is a top mold tool.

4. The apparatus according to claim 1, wherein the mold volume is delimited by a planar boundary surface of the first mold tool and a three-dimensionally profiled boundary surface of the second mold tool.

5. The apparatus according to claim 1, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume in a stacking direction, in particular exclusively in a stacking direction, of the first mold tool and the second mold tool.

6. The apparatus according to claim 1, wherein the first mold tool and the second mold tool are configured so that despite of the motion, the dimension of the mold volume remains constant in a plane perpendicular to a stacking direction of the first mold tool and the second mold tool.

7. The apparatus according to claim 1, wherein the first mold tool and the second mold tool are configured so that the mold volume comprises a plurality of separate volume sections in fluid communication with one another, wherein a respective physical body is manufacturable in each of the volume sections, in particular by simultaneously supplying the respective mold material into at least two of the volume sections.

8. The apparatus according to claim 1, configured for manufacturing a semiconductor package as physical body.

9. The apparatus according to claim 1, wherein the supply unit comprises:

a first supply path configured for supplying the first mold material, in particular from a first reservoir, to the mold volume; and

a second supply path configured for supplying the second mold material, in particular from a second reservoir, to the mold volume with the increased dimension.

10. The apparatus according to claim 1, wherein the supply unit comprises a common supply path for supplying the first mold material and the second mold material to the mold volume.

11. The apparatus according to claim 10, wherein the supply unit is configured for simultaneously transporting a first volume of first mold material followed by a separate second volume of second mold material to the mold volume.

12. The apparatus according to claim 11, wherein the supply unit is configured for interposing a dummy spacer between the simultaneously transported first volume of first mold material and second volume of second mold material to thereby maintain the first volume of first mold material and the second volume of second mold material separate from one another upstream of the mold volume.

13. The apparatus according to claim 12, wherein the supply unit is configured for transporting the dummy spacer continuously along a first direction, and is configured for transporting the first volume of first mold material and the second volume of second mold material along the first direction until the first mold material and the second mold material reach the mold volume, and wherein the supply unit is configured for transporting the first volume of first mold material and the second volume of second mold material along another second direction into the mold volume when the first mold material and the second mold material have reached the mold volume.

14. The apparatus according to claim 1, wherein the supply unit comprises at least one movable plunger configured for moving at least one of the first mold material and the second mold material.

15. The apparatus according to claim 1, wherein at least part of at least one of the first mold tool and the second mold tool is configured to be further movable to thereby further increase the dimension of the increased mold volume after having supplied the second mold material to the increased mold volume and before and/or during supplying a third mold material to the further increased mold volume.

16. A method of manufacturing a physical body comprising at least two different mold materials by molding, wherein the method comprises:

defining an initial mold volume between a first mold tool and a second mold tool;

supplying a first mold material to the initial mold volume;

subsequently moving at least part of at least one of the first mold tool and the second mold tool to thereby change the dimension of the mold volume compared to the initial mold volume;

supplying the second mold material to the mold volume with the changed dimension during and/or after the moving, wherein the first mold material and the second mold material have different physical properties.

17. The method according to claim 16, wherein the method comprises manufacturing a semiconductor package as the physical body, wherein in particular the semiconductor package comprises at least one semiconductor chip which is at least partially encapsulated by the first mold material which is, in turn, at least partially encapsulated by the second mold material.

18. The method according to claim 17, wherein the first mold tool and the second mold tool are assembled to one another before supplying the first mold material to the mold volume, and are only disassembled from one another for taking the physical body out of the mold tools after supplying the second mold material to the mold volume.