MEMS device, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of MEMS device

• US 10,639,889 B2
• Filed: 11/14/2018
• Issued: 05/05/2020
• Est. Priority Date: 11/16/2017
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Mizuta, Shohei, Hirai, Eiju, Yamada, Daisuke, Naganuma, Yoichi, Takabe, Motoki
• Primary Examiner(s): Mruk, Geoffrey S
• Application Number:
  US16/191,282
• Publication Number:
  US 20190143691A1
• Time in Patent Office: 538 Days
• CPC Class Codes: B41J 2/14201 Structure of print heads with piezoelectric elements
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2002/14491 Electrical connection
• CPC Class Codes: B41J 2202/18 Electrical connection established using vias
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/2047 Membrane type
• CPC Class Codes: H10N 30/875 Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins

Abstract

A MEMS device which includes an adhesive which adheres a first substrate and a second substrate to each other, in which a first space which includes an electrode, an individual electrode, a common electrode, a bump electrode, and a piezoelectric element and which is configured as a closed space which is isolated from an atmosphere by the first substrate, the second substrate, and the adhesive is disposed in a space between the first substrate and the second substrate, and in which a second space which does not include any of the electrode, the individual electrode, the common electrode, the bump electrode, or the piezoelectric element and which communicates with the atmosphere due to a through-hole which penetrates at least one of the first substrate and the second substrate is disposed in the space between the first substrate and the second substrate.

Claims

1. A MEMS device comprising:

a first substrate which includes a first electrode;

a second substrate which includes a second electrode and on which the first electrode and the second electrode are disposed by being laminated between the second substrate and the first substrate;

a third electrode which is disposed between the first substrate and the second substrate and which electrically connects the first electrode and the second electrode to each other;

a piezoelectric element which is disposed between the first substrate and the second substrate; and

an adhesive which adheres the first substrate and the second substrate to each other,

wherein a first space which includes the first electrode, the second electrode, the third electrode, and the piezoelectric element and which is configured as a closed space which is isolated from an atmosphere by the first substrate, the second substrate, and the adhesive is disposed in a space between the first substrate and the second substrate, and

wherein a second space which does not include any of the first electrode, the second electrode, the third electrode, or the piezoelectric element and which communicates with the atmosphere due to a through-hole which penetrates at least one of the first substrate and the second substrate is disposed in the space between the first substrate and the second substrate.

2. The MEMS device according to claim 1, further comprising:

a wiring which is electrically connected to at least one of the first electrode, the second electrode, the third electrode, and the piezoelectric element,

wherein the wiring which is contained in the second space is isolated from the atmosphere by a protective layer which covers the wiring.

3. The MEMS device according to claim 2,

wherein a plurality of adhering regions which are adhered by the adhesive adhere the first substrate and the second substrate to each other, by interposing the protective layer therebetween.

4. A liquid ejecting head comprising:

the MEMS device according to claim 3.

5. A liquid ejecting head comprising:

the MEMS device according to claim 2.

6. A liquid ejecting head comprising:

the MEMS device according to claim 1.

7. A liquid ejecting apparatus comprising:

the liquid ejecting head according to claim 6.