Thermal print head
First Claim
1. A thermal print head comprising:
- a main substrate having an obverse surface;
a resistor layer supported by the main substrate and having a plurality of heat generators arranged in a main scanning direction;
a first wiring layer supported by the main substrate and constituting an energization path to the plurality of heat generators;
at least one driver IC that performs energization control on the plurality of heat generators; and
a flexible wiring substrate having a second wiring layer jointed to the first wiring layer via an anisotropic conductive joint material,wherein the driver IC is mounted on the flexible wiring substrate.
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Accused Products
Abstract
A thermal print head includes: a substrate having an obverse surface; a plurality of heat generators arranged on the substrate in a main scanning direction; and a wiring layer provided on the substrate and constituting an energization path to the heat generators. The substrate has a protrusion protruding from the obverse surface and extending in the main scanning direction. The protrusion has a top portion having the largest distance from the obverse surface, and an inclined portion connected to the top portion in a sub-scanning direction. The inclined portion is inclined relative to the obverse surface at a predetermined angle. Each of the plurality of heat generators extends across a boundary between the top portion and the inclined portion. Each of the heat generators is formed on at least a part of the top portion and at least a part of the inclined portion in the sub-scanning direction.
5 Citations
19 Claims
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1. A thermal print head comprising:
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a main substrate having an obverse surface; a resistor layer supported by the main substrate and having a plurality of heat generators arranged in a main scanning direction; a first wiring layer supported by the main substrate and constituting an energization path to the plurality of heat generators; at least one driver IC that performs energization control on the plurality of heat generators; and a flexible wiring substrate having a second wiring layer jointed to the first wiring layer via an anisotropic conductive joint material, wherein the driver IC is mounted on the flexible wiring substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification