Systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element
First Claim
1. A micro-electro-mechanical systems (MEMS) component comprising:
- a fixed electrode positioned on a substrate;
a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap; and
at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap;
wherein one or both of the fixed electrode or the moveable electrode is patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump; and
wherein the one or more hole extends beyond all edges of the at least one standoff bump such that a distance between an edge of the hole and a respective edge of the at least one standoff bump is greater than or about equal to a height of the at least one standoff bump and less than or about equal to a maximum gap spacing between the fixed electrode and the movable electrode.
2 Assignments
0 Petitions
Accused Products
Abstract
The present subject matter relates to systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element. In particular, a micro-electro-mechanical systems (MEMS) can comprise a fixed electrode positioned on a substrate, a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap, and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap. In this configuration, one or both of the fixed electrode or the moveable electrode can be patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump. The bump and the hole can both help to reduce the rate of surface dielectric charging and the total amount of charge generated.
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Citations
21 Claims
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1. A micro-electro-mechanical systems (MEMS) component comprising:
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a fixed electrode positioned on a substrate; a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap; and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap; wherein one or both of the fixed electrode or the moveable electrode is patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump; and wherein the one or more hole extends beyond all edges of the at least one standoff bump such that a distance between an edge of the hole and a respective edge of the at least one standoff bump is greater than or about equal to a height of the at least one standoff bump and less than or about equal to a maximum gap spacing between the fixed electrode and the movable electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A micro-electro-mechanical systems (MEMS) component comprising:
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a fixed electrode positioned on a substrate; a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap; and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap; wherein the moveable electrode is patterned to define one or more hole that is substantially aligned with one or more of the at least one standoff bump, the hole having a dimension that is larger than a width of the at least one standoff bump but smaller than a maximum gap spacing between the fixed electrode and the movable electrode; and wherein an amount that the one or more hole extends beyond a periphery of the at least one standoff bump is significantly larger than a minimum gap spacing between the fixed electrode and the movable electrode. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method for forming a micro-electro-mechanical systems (MEMS) component, the method comprising:
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depositing a fixed electrode on a substrate; depositing a sacrificial layer over the fixed electrode; etching the sacrificial layer to define at least one standoff cavity over the fixed electrode; depositing one or more movable dielectric layers over the sacrificial layer, wherein at least one standoff bump is defined in the at least one standoff cavity; depositing a movable electrode over the one or more movable dielectric layers; etching the movable electrode to define one or more hole that is substantially aligned with one or more of the at least one standoff bump; and removing the sacrificial layer such that the one or more movable dielectric layers and the movable electrode are spaced apart from the fixed electrode by a gap; wherein an amount that the one or more hole extends beyond a periphery of the at least one standoff bump is significantly larger than a minimum gap spacing between the fixed electrode and the movable electrode. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification