Microelectromechanical system (MEMS) devices
First Claim
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1. A microelectromechanical systems (MEMS) device comprising:
- a number of silicon dies overmolded with an overmold material;
a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; and
a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding silicon die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active areas of the number of silicon dies.
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Abstract
One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.
11 Citations
20 Claims
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1. A microelectromechanical systems (MEMS) device comprising:
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a number of silicon dies overmolded with an overmold material; a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; and a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding silicon die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active areas of the number of silicon dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a microelectromechanical systems (MEMS) device comprising:
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overmolding a number of dies with an overmold material to form a coplanar package, the dies comprising a number of electrically active devices; and forming a fan-out layer on the coplanar package to increase distances between a number of features of the dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices of the dies and cause a fluid to flow to the electrically active devices, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active devices of the number of dies. - View Dependent Claims (13, 14, 15, 16)
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17. A lab-on-chip system comprising:
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a plurality of silicon dies; a number of electrically active devices disposed on a first side of the silicon dies; an overmold material overmolded over all sides of the silicon dies other than the first side; a fan-out layer coupled to each of the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices; and an electrical redistribution layer (RDL) positioned between the fan-out layer and the silicon dies to electrically couple the electrically active devices to an external circuit; wherein the active devices further comprise a number of actuators and a number of sensors, the number of actuators to cause fluid introduced into the fluid channels to interact with number of sensors. - View Dependent Claims (18, 19, 20)
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Specification