Microelectromechanical system (MEMS) device packaging
First Claim
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1. A microelectromechanical system (MEMS) device comprising:
- a substrate;
a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port;
a microelectromechanical component disposed within the interior cavity; and
a non-continuous tag coupled to the substrate and the cap, wherein the non-continuous tag is positioned at one or more discrete locations along a periphery of the cap to secure the cap to the substrate.
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Abstract
Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.
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Citations
20 Claims
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1. A microelectromechanical system (MEMS) device comprising:
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a substrate; a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port; a microelectromechanical component disposed within the interior cavity; and a non-continuous tag coupled to the substrate and the cap, wherein the non-continuous tag is positioned at one or more discrete locations along a periphery of the cap to secure the cap to the substrate. - View Dependent Claims (2, 3, 4, 5)
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6. A microelectromechanical system (MEMS) device comprising:
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a substrate; a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port; a microelectromechanical component disposed within the interior cavity; and a tag coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A populated printed-circuit-board (PCB) blank comprising:
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a substrate; a plurality of microelectromechanical devices positioned along the substrate, each of the plurality of microelectromechanical devices including; a lid coupled to the substrate, wherein the substrate and the lid cooperatively define an interior cavity; and a microelectromechanical component positioned within the interior cavity; and a plurality of tags, wherein each of the plurality of tags is positioned between adjacent microelectromechanical devices such that (i) at least a portion of a first end of each lid is secured to the substrate and (ii) at least a portion of an opposing second end of each lid is secured to the substrate.
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Specification