Microelectromechanical system (MEMS) device packaging

• US 10,640,371 B2
• Filed: 02/08/2019
• Issued: 05/05/2020
• Est. Priority Date: 07/27/2016
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Lim, Tony K., Talag, Norman Dennis
• Primary Examiner(s): Laekemariam, Yosef K
• Application Number:
  US16/270,703
• Publication Number:
  US 20190169022A1
• Time in Patent Office: 452 Days
• Field of Search: 381 91, 381112, 381113, 381114, 381122, 381174, 381175, 381176, 381372
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/016 for microphones
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.

Claims

1. A microelectromechanical system (MEMS) device comprising:

a substrate;

a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port;

a microelectromechanical component disposed within the interior cavity; and

a non-continuous tag coupled to the substrate and the cap, wherein the non-continuous tag is positioned at one or more discrete locations along a periphery of the cap to secure the cap to the substrate.

2. The MEMS device of claim 1, wherein the microelectromechanical component is coupled to the one of the substrate or the cap that defines the port such that the microelectromechanical component is positioned over the port.

3. The MEMS device of claim 1, further comprising a guard ring positioned between the substrate and the cap.

4. The MEMS device of claim 3, wherein the guard ring defines at least one of an aperture or a semi-cutout, and wherein the non-continuous tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the guard ring.

5. The MEMS device of claim 1, wherein the cap defines at least one of an aperture or a semi-cutout, and wherein the non-continuous tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the cap.

6. A microelectromechanical system (MEMS) device comprising:

a substrate;

a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port;

a microelectromechanical component disposed within the interior cavity; and

a tag coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.

7. The MEMS device of claim 6, wherein the microelectromechanical component is coupled to the one of the substrate or the cap that defines the port such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity.

8. The MEMS device of claim 6, wherein the tag is a non-continuous tag positioned at a discrete location along a periphery of the cap.

9. The MEMS device of claim 8, wherein the non-continuous tag is a first non-continuous tag, further comprising a second non-continuous tag coupled to the substrate and the exterior surface of the cap, the second non-continuous tag positioned at a second discrete location along the periphery of the cap.

10. The MEMS device of claim 7, wherein the tag extends along at least a portion of a periphery of the cap.

11. The MEMS device of claim 10, wherein the tag extends along the entire periphery of the cap.

12. The MEMS device of claim 6, wherein the substrate defines the port.

13. The MEMS device of claim 6, wherein the cap defines the port.

14. The MEMS device of claim 6, wherein the microelectromechanical component includes at least one of a pierced microphone or a non-pierced microphone.

15. The MEMS device of claim 6, further comprising a guard ring positioned between the substrate and the cap.

16. The MEMS device of claim 15, wherein the guard ring defines at least one of an aperture or a semi-cutout.

17. The MEMS device of claim 16, wherein the tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the guard ring.

18. The MEMS device of claim 6, wherein the cap defines at least one of an aperture or a semi-cutout.

19. The MEMS device of claim 18, wherein the tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the cap.

20. A populated printed-circuit-board (PCB) blank comprising:

a substrate;

a plurality of microelectromechanical devices positioned along the substrate, each of the plurality of microelectromechanical devices including;

a lid coupled to the substrate, wherein the substrate and the lid cooperatively define an interior cavity; and

a microelectromechanical component positioned within the interior cavity; and

a plurality of tags, wherein each of the plurality of tags is positioned between adjacent microelectromechanical devices such that (i) at least a portion of a first end of each lid is secured to the substrate and (ii) at least a portion of an opposing second end of each lid is secured to the substrate.