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Thermally conductive resin composition

  • US 10,640,631 B2
  • Filed: 06/30/2016
  • Issued: 05/05/2020
  • Est. Priority Date: 07/02/2015
  • Status: Active Grant
First Claim
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1. A thermally conductive resin composition comprising:

  • a resin (A) having a melting point of from 40 to 100°

    C. andan inorganic filler (B), anda liquid resin (C)whereinthe resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150°

    C. for 100 hours under an atmosphere,the resin (A) comprises a fatty acid ester or a fatty acid amide having from 1 to 100 carbon atoms,the inorganic filler (B) comprises 90% by weight or more of a spherical powder per 100% by weight of a total amount of the inorganic filler (B),the inorganic filler (B) comprises 40% by weight or more of a powder having an average particle diameter of from 1 to 3 μ

    m per 100% by weight of a total amount of the inorganic filler (B), andthe liquid resin (C) comprises an acrylate resin.

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