Thermally conductive resin composition
First Claim
Patent Images
1. A thermally conductive resin composition comprising:
- a resin (A) having a melting point of from 40 to 100°
C. andan inorganic filler (B), anda liquid resin (C)whereinthe resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150°
C. for 100 hours under an atmosphere,the resin (A) comprises a fatty acid ester or a fatty acid amide having from 1 to 100 carbon atoms,the inorganic filler (B) comprises 90% by weight or more of a spherical powder per 100% by weight of a total amount of the inorganic filler (B),the inorganic filler (B) comprises 40% by weight or more of a powder having an average particle diameter of from 1 to 3 μ
m per 100% by weight of a total amount of the inorganic filler (B), andthe liquid resin (C) comprises an acrylate resin.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention relates to a thermally conductive resin composition containing a resin (A) having a melting point of 40 to 100° C. and an inorganic filler (B), wherein the resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150° C. for 100 hours under an atmosphere. The thermally conductive resin composition of the present invention is suitably used for a thermal interface material (TIM), particularly TIM for a semiconductor module.
3 Citations
9 Claims
-
1. A thermally conductive resin composition comprising:
-
a resin (A) having a melting point of from 40 to 100°
C. andan inorganic filler (B), and a liquid resin (C) wherein the resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150°
C. for 100 hours under an atmosphere,the resin (A) comprises a fatty acid ester or a fatty acid amide having from 1 to 100 carbon atoms, the inorganic filler (B) comprises 90% by weight or more of a spherical powder per 100% by weight of a total amount of the inorganic filler (B), the inorganic filler (B) comprises 40% by weight or more of a powder having an average particle diameter of from 1 to 3 μ
m per 100% by weight of a total amount of the inorganic filler (B), andthe liquid resin (C) comprises an acrylate resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification