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CMP compositions selective for oxide and nitride with improved dishing and pattern selectivity

  • US 10,640,679 B2
  • Filed: 10/16/2017
  • Issued: 05/05/2020
  • Est. Priority Date: 10/17/2016
  • Status: Active Grant
First Claim
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1. A chemical-mechanical polishing composition comprising:

  • (a) a wet-process ceria abrasive,(b) a polyhydroxy aromatic carboxylic acid, wherein the polyhydroxy aromatic carboxylic acid is 3,5-dihydroxybenzoic acid,(c) optionally, an ionic polymer of formula (I);

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