Heat treatment system, heat treatment method, and program

• US 10,640,871 B2
• Filed: 02/22/2016
• Issued: 05/05/2020
• Est. Priority Date: 02/24/2015
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Takenaga, Yuichi, Ota, Hiroichi, Sekisawa, Shingo
• Primary Examiner(s): Lee, Aiden
• Application Number:
  US15/050,006
• Publication Number:
  US 20160244881A1
• Time in Patent Office: Days
• Field of Search: 118715
• CPC Class Codes: C23C 16/45578 Elongated nozzles, tubes with holes
• CPC Class Codes: C23C 16/4583 the substrate being supported substantially horizontally
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A heat treatment system includes a heating unit that heats an inside of a processing chamber in which a plurality of workpieces are accommodated; a heat treatment condition storing unit that stores a heat treatment condition; a heat treatment change model storing unit that stores a heat treatment change model; a heat treatment performing unit that performs the heat treatment condition; a heat treatment result receiving unit that receives a result of heat treatment performed; and an optimum temperature calculating unit that calculate a target heat treatment result for an in-plane shape of the workpiece based on a target heat treatment result and information about a shape of the target heat treatment result, and calculate an optimum temperature that results in the target heat treatment result, based on the calculated target heat treatment result and the heat treatment change model.

Claims

1. A heat treatment system comprising:

a heater configured to heat an inside of a processing chamber in which a workpiece is accommodated; and

a controller that performs an overall control of the heat treatment system,

wherein the controller is configured to;

store a recipe according to heat treatment content, including a temperature in the processing chamber heated by the heater;

store a heat treatment change model that represents a relationship between a change of a temperature in the processing chamber and a corresponding change in film thickness resulting from the change of the temperature;

calculate a film thickness by converting inputted target information with respect to an in-plane shape of a film to be formed on the workpiece, prior to forming the film on the workpiece and prior to receiving a measured film thickness;

form the film on the workpiece by reading the stored recipe;

receive the measured film thickness of the film formed on the workpiece; and

calculate an optimum temperature that results in the inputted target information, based on the stored heat treatment change model when the measured film thickness does not fall within an allowable range relative to the inputted target information.

2. The heat treatment system of claim 1, wherein the processing chamber is divided into a plurality of zones, each including at least a workpiece,

the heater is configured to set a temperature for each of the zones in the processing chamber,

the controller is further configured to:

store a recipe for each of the zones in the processing chamber;

store a heat treatment change model that represents a relationship between a change of a temperature in the processing chamber for each of the zones and a change of a corresponding film thickness resulting from the change of the temperature for each of the zones;

calculate a film thickness for each zone by converting inputted target information with respect to an in-plane shape of a film to be formed on the workpiece for each zone; and

calculate an optimum temperature for each of the zones that results in the inputted target information based on the stored heat treatment change model when measured thicknesses do not fall within an allowable range relative to the inputted target information for each zone.

3. The heat treatment system of claim 1, wherein the heat treatment content is a film formation processing.

4. The heat treatment system of claim 3, wherein the inputted target information with respect to the in-plane shape of the film to be formed on the workpiece includes a thickness of a center of the film to be formed on the workpiece and a thickness of an edge of the film to be formed on the workpiece.

5. The heat treatment system of claim 3, wherein the inputted target information with respect to the in-plane shape of the film to be formed on the workpiece includes a thickness of the film to be formed on the workpiece, a shape of the film to be formed on the workpiece, and an in-plane uniformity of the film to be formed on the workpiece.

6. The heat treatment system of claim 3, wherein the inputted target information with respect to the in-plane shape of the film to be formed on the workpiece includes a thickness of the film to be formed on the workpiece, a shape of the film to be formed on the workpiece, and an in-plane range of the film to be formed on the workpiece.

7. The heat treatment system of claim 5, wherein the shape of the film includes a convex, a concave, or a flat shape.

8. The heat treatment system of claim 6, wherein the shape of the film includes a convex, a concave, or a flat shape.

9. A heat treatment method by using the heat treatment system of claim 1.

10. A non-transitory computer-readable storage medium that stores a program which, when executed, causes a computer to control the heat treatment method of claim 5.