Wet type processing apparatus for resin film

• US 10,640,875 B2
• Filed: 01/12/2016
• Issued: 05/05/2020
• Est. Priority Date: 01/12/2016
• Status: Active Grant

• Current Assignee: Chuo Kikai Co., Ltd., JCU Corporation
• Original Assignee: JCU Corporation
• Inventors: Kohtoku, Makoto, Nakamaru, Yaichiro, Shinozaki, Yukio, Aoki, Tetsuya, Matsukura, Takashi, Hashimoto, Goki
• Primary Examiner(s): Pence, Jethro M.
• Application Number:
  US16/068,996
• Publication Number:
  US 20190024238A1
• Time in Patent Office: 1,575 Days
• Field of Search: None
• CPC Class Codes: C23C 18/1628 Specific elements or parts of the apparatus
• CPC Class Codes: C23C 18/1632 Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
• CPC Class Codes: C23C 18/32 Coating with nickel, cobalt or mixtures thereof with phosphorus or boron C23C18/50 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/187 means therefor, e.g. baths, apparatus

Abstract

A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.

Claims

1. A wet type processing apparatus for resin film, processing a coating treatment of a conductive metal on a surface of the resin film by dipping in a prescribed processing liquid a web formed resin film adsorbing metal ion catalyst on the surface thereof, comprising:

a processing bath for reserving inside the processing liquid and rendering the resin film passing through the processing liquid;

a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and

a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a rectangular upper surface opposite a circumferential surface having a plurality of holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the plurality of holes and wherein the plurality of holes are adjustable, such that a spouting angle may be adjusted;

a head tank connected to the spouting unit via a supply pipe, wherein the head tank is coupled at a position higher than the liquid surface of the processing liquid and the supply pipe further comprises a flow meter;

at least one transmission type sensor comprising a light emitting element and photo receiving element configured to monitor the resin film.

2. The wet type processing apparatus for resin film according to claim 1, wherein the processing liquid is an electroless metal plating liquid, and wherein a metal film formed with the electroless metal plating liquid comprises a seed layer for subsequent wet type formation of a metal film.

3. The wet type processing apparatus for resin film according to claim 1, wherein the resin film is a polyimide film or other heat insulating resin films.

4. The wet type processing apparatus for resin film according to claim 3, wherein the polyimide film has a thickness of 12.5 microns or lower.

5. The wet type processing apparatus for resin film according to claim 1, wherein the plurality of holes of the spouting unit provide a spouting flow of 100 liters or less per minute.