Plated material and connecting terminal using same
First Claim
1. A plated material, comprising a region where a reflow tin-plated layer has been formed and another region where a silver-plated layer has been formed, on a surface of a metal substrate, respectively, whereinthe silver-plated layer is formed on the surface of the metal substrate via a nickel-plated layer;
- the reflow tin-plated layer and the nickel-plated layer are formed on the surface of the metal substrate via a reactive layer, respectively;
the silver-plated layer is metallurgically bonded to the nickel-plated layer;
the nickel-plated layer is metallurgically bonded to the reactive layer;
the reflow tin-plated layer is directly on the reactive layer; and
the reactive layer contains Cu3Sn.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.
4 Citations
3 Claims
-
1. A plated material, comprising a region where a reflow tin-plated layer has been formed and another region where a silver-plated layer has been formed, on a surface of a metal substrate, respectively, wherein
the silver-plated layer is formed on the surface of the metal substrate via a nickel-plated layer; -
the reflow tin-plated layer and the nickel-plated layer are formed on the surface of the metal substrate via a reactive layer, respectively; the silver-plated layer is metallurgically bonded to the nickel-plated layer; the nickel-plated layer is metallurgically bonded to the reactive layer; the reflow tin-plated layer is directly on the reactive layer; and the reactive layer contains Cu3Sn. - View Dependent Claims (2, 3)
-
Specification