Shock reducing tape spring hinge

• US 10,641,320 B2
• Filed: 03/03/2017
• Issued: 05/05/2020
• Est. Priority Date: 11/21/2016
• Status: Active Grant

• Current Assignee: Korea Aerospace Research Institute
• Original Assignee: Korea Aerospace Research Institute
• Inventors: Lee, Chang Ho, Kim, Kyung Won, Jeong, Ju Won, Kim, Young Jin, Lee, Jung Ju
• Primary Examiner(s): Tillman, Jr., Reginald S
• Application Number:
  US15/448,889
• Publication Number:
  US 20180142729A1
• Time in Patent Office: 1,159 Days
• Field of Search: 16225
• CPC Class Codes: B64G 1/222 for deploying structures between a stowed and deployed state
• CPC Class Codes: B64G 1/2222 Folding
• CPC Class Codes: B64G 1/2229 characterised by the deployment actuating mechanism inflating B64G1/2227
• CPC Class Codes: B64G 1/443 Photovoltaic cell arrays
• CPC Class Codes: F16C 11/12 incorporating flexible connections, e.g. leaf springs
• CPC Class Codes: F16F 1/027 Planar, e.g. in sheet form; leaf springs
• CPC Class Codes: F16F 13/00 Units comprising springs of the non-fluid type as well as vibration-dampers, shock-absorbers, or fluid springs F16F5/00, F16F6/00, F16F9/003 take precedence
• CPC Class Codes: F16F 2224/0258 Shape-memory metals, e.g. Ni-Ti alloys
• CPC Class Codes: F16F 3/02 with springs made of steel or of other material having low internal friction

Abstract

Provided is a shock reducing tape spring hinge including fixing members fixed to at least two objects, respectively, a thin shell type tape spring having both end portions that are fastened to the fixing members, respectively, and a shell-shaped damping plate aligned with the tape spring, the damping plate having both end portions that are fastened to the fixing members, respectively. The damping plate and the tape spring may be configured to connect the at least two objects being spaced through the fixing members, and the damping plate may be configured to reduce a deployment shock occurring when the tape spring is deployed.

Claims

1. A shock reducing tape spring hinge, comprising:

fixing members fixed to at least two objects, respectively;

a first tape spring having both end portions that are fastened to the fixing members, respectively; and

a shape memory alloy damping plate aligned with the first tape spring, the shape memory alloy damping plate having both end portions that are fastened to the fixing members, respectively,

wherein the shape memory alloy damping plate and the first tape spring are configured to connect the at least two objects being spaced through the fixing members, and the shape memory alloy damping plate is configured to reduce a deployment shock occurring when the first tape spring is deployed, and

wherein the shape memory alloy damping plate has an opening and the opening has a size, and

wherein at least the opening of the shape memory alloy damping plate and the size of the opening define a residual moment of the shape memory alloy damping plate that resists a deployment moment caused by the deployment of the first tape spring.

2. The shock reducing tape spring hinge of claim 1, further comprising a second tape spring, wherein the first and second tape springs are disposed parallel to each other, and

the shape memory alloy damping plate is disposed between the first and second tape springs.

3. The shock reducing tape spring hinge of claim 1, wherein the shape memory alloy damping plate has a crystal structure and a mechanical characteristic that change based on a temperature.

4. The shock reducing tape spring hinge of claim 3, wherein the shape memory alloy damping plate comprises a shape memory alloy, and

the shape memory alloy damping plate is deployed in a state of being bent along with the first tape spring, and simultaneously the shape memory alloy damping plate is configured to reduce a deployment speed of the first tape spring based at least in part on the residual moment corresponding to the deployment moment of the first tape spring.

5. The shock reducing tape spring hinge of claim 1, wherein the opening is formed or arranged at a center of the shape memory alloy damping plate.

6. The shock reducing tape spring hinge of claim 1, wherein the first tape spring and the shape memory alloy damping plate each have a curved cross section.

7. The shock reducing tape spring hinge of claim 1, wherein the residual moment is adjusted when at least the size of the opening is adjusted.

8. The shock reducing tape spring hinge of claim 4, wherein the deployment moment and/or the residual moment is adjusted based at least in part on:

(i) one or more components or one or more characteristics of the shape memory alloy of the shape memory alloy damping plate and/or (ii) using the opening formed in the shape memory alloy damping plate.

9. The shock reducing tape spring hinge of claim 4, wherein a stiffness of the shape memory alloy damping plate increases as an austenite phase transformation occurs due to an increase of a temperature of a hinge which increases as a temperature of a solar array increases.