Wafer inspection apparatus
First Claim
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1. A wafer inspection apparatus, comprising:
- a magnetic field generating unit forming a magnetic field such that magnetic lines of force flow in a direction perpendicular to a first surface of a wafer on which a magnetic film is formed and the magnetic lines of force also flow in a direction parallel to the first surface of the wafer;
a microwave guide unit emitting microwaves to a measurement region that is at least a partial region of the wafer and is a region affected by the magnetic field generated by the magnetic field generating unit, the microwave guide unit being arranged to be distanced from the first surface of the wafer by a predetermined distance when emitting microwaves; and
a sensing unit receiving waves reflected or transmitted after the microwaves are emitted to the measurement region from the microwave guide unit.
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Abstract
Disclosed is a wafer inspection apparatus. The wafer inspection apparatus includes: a magnetic field generating unit forming a magnetic field such that magnetic lines of force flow in a direction perpendicular or parallel to a first surface of a wafer on which a magnetic thin film is formed; a microwave guide unit emitting microwaves to a measurement region that is at least a partial region of the wafer and is a region affected by the magnetic field generated by the magnetic field generating unit; and a sensing unit receiving waves reflected or transmitted after the microwaves are emitted to the measurement region from the microwave guide unit.
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18 Claims
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1. A wafer inspection apparatus, comprising:
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a magnetic field generating unit forming a magnetic field such that magnetic lines of force flow in a direction perpendicular to a first surface of a wafer on which a magnetic film is formed and the magnetic lines of force also flow in a direction parallel to the first surface of the wafer; a microwave guide unit emitting microwaves to a measurement region that is at least a partial region of the wafer and is a region affected by the magnetic field generated by the magnetic field generating unit, the microwave guide unit being arranged to be distanced from the first surface of the wafer by a predetermined distance when emitting microwaves; and a sensing unit receiving waves reflected or transmitted after the microwaves are emitted to the measurement region from the microwave guide unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification