Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
First Claim
1. A compliant probe comprising:
- a) a first planarized layer comprising at least a first structural material and a second structural material located above at least a portion of the first structural material wherein at least the second structural material is planarized to set a boundary level for the first planarized layer;
b) a second planarized layer comprising at least a third structural material, wherein the third structural material is either directly adhered to a material selected from the group consisting of the first structural material of the first planarized layer, the second structural material of the first planarized layer, and a material of an intermediate layer that separates the first planarized layer from the second planarized layer;
wherein the second structural material of the first planarized layer is different from both the first structural material of the first planarized layer and the third structural material of the second planarized layer, wherein the second structural material of the first planarized layer has sides, and wherein at least a portion of the sides of the second structural material of the first planarized layer are bounded by the first structural material of the first planarized layer, andwherein the first, second, and third structural materials are metals;
wherein upon use, the compliant probe is configured to provide an electrical contact with an integrated circuit.
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Accused Products
Abstract
Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
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Citations
20 Claims
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1. A compliant probe comprising:
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a) a first planarized layer comprising at least a first structural material and a second structural material located above at least a portion of the first structural material wherein at least the second structural material is planarized to set a boundary level for the first planarized layer; b) a second planarized layer comprising at least a third structural material, wherein the third structural material is either directly adhered to a material selected from the group consisting of the first structural material of the first planarized layer, the second structural material of the first planarized layer, and a material of an intermediate layer that separates the first planarized layer from the second planarized layer; wherein the second structural material of the first planarized layer is different from both the first structural material of the first planarized layer and the third structural material of the second planarized layer, wherein the second structural material of the first planarized layer has sides, and wherein at least a portion of the sides of the second structural material of the first planarized layer are bounded by the first structural material of the first planarized layer, and wherein the first, second, and third structural materials are metals; wherein upon use, the compliant probe is configured to provide an electrical contact with an integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising:
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a) a first planarized layer comprising at least a first structural material; b) a second planarized layer comprising at least a second structural material, wherein the second structural material of the second planarized layer has a relationship with the first planarized layer selected from the group consisting of;
(1) the second structural material of the second planarized layer is directly adhered to the first planarized layer, (2) the second structural material or the second planarized layer is separated from the first planarized layer by at least one intermediate layer, and (3) the second structural material of the second planarized layer is separated from the first planarized layer by at least one deposition of material;c) a third planarized layer comprising at least a third structural material, wherein the third structural material of the third planarized layer has a relationship with the second planarized layer selected from the group consisting of;
(1) the third structural material of the third planarized layer is adhered directly to the second planarized layer, (2) the third structural material of the third planarized layer is separated from the second planarized layer by at least one intermediate layer, and (3) the third structural material of the third planarized layer is separated from the second planarized layer by at least one deposition of material,wherein the second planarized layer is located between the first and third planarized layers, and wherein the second structural material is different from both the first structural material and the third structural material, and wherein the compliant probe is configured to provide a compliant electrical contact element that provides a conductive path between the at least two electronic components, wherein each of at least one of the first to third planarized layers comprises at least one core structural material and at least one shell structural material, wherein one of the at least one core structural material and the at least one shell structural material of a respective layer corresponds to a respective first structural material, second structural material, or third structural material while another of the at least one shell structural material and at least one core structural material do not, and wherein the shell structural material of the respective layer surrounds a bottom and sides of at least selected volumes of the core structural material of the respective layer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification