Crosstalk suppression in wireless testing of semiconductor devices

• US 10,641,821 B2
• Filed: 10/13/2017
• Issued: 05/05/2020
• Est. Priority Date: 02/28/2007
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Pagani, Alberto
• Primary Examiner(s): Le, Son T
• Application Number:
  US15/782,962
• Publication Number:
  US 20180045775A1
• Time in Patent Office: 935 Days
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit is fabricated on a semiconductor material die and adapted to be at least partly tested wirelessly. Circuitry for setting a selected radio communication frequency to be used for the wireless test of the integrated circuit is integrated on the semiconductor material die.

Claims

1. An apparatus, comprising:

a wireless probe card having a plurality of wireless units, the plurality of wireless units including at least a first wireless unit and a second wireless unit;

wherein the first wireless unit is configured to wirelessly communicate with a first integrated circuit die from among a plurality of integrated circuit dies under test at a first frequency, the first integrated circuit die being integrated within a single wafer and including a radio frequency selector configured to select the first frequency for use by the first integrated circuit die from among a plurality of radio frequencies,

wherein the second wireless unit is configured to wirelessly communicate with a second integrated circuit die from among the plurality of integrated circuit dies under test at a second frequency different than the first frequency, the second integrated circuit die being integrated within the single wafer and including a radio frequency selector configured to select the second frequency for use by the second integrated circuit die from among the plurality of radio frequencies.

2. The apparatus of claim 1, wherein the plurality of wireless units further includes a third wireless unit;

wherein the third wireless unit is configured to wireless communicate with a third integrated circuit die from among the plurality of integrated circuit dies under test at a third frequency different than the second frequency, the third integrated circuit die being integrated within the single wafer and including a radio frequency selector configured to select the third frequency for use by the third integrated circuit die from among the plurality of radio frequencies.

3. The apparatus of claim 1, wherein the radio frequency selector of the first integrated circuit die comprises at least one programmable element configured to store a value for selecting among the plurality of radio frequencies such that the radio frequency selector is configurable to define the first frequency, the first frequency to be used for wirelessly receiving a radio signal having a test signal modulated thereon for a wireless test of the first integrated circuit die.

4. The apparatus of claim 3, wherein the radio frequency selector of the second integrated circuit die comprises at least one programmable element configured to store a value for selecting among the plurality of radio frequencies such that the radio frequency selector is configurable to define the second frequency, the second frequency to be used for wirelessly receiving a radio signal having a test signal modulated thereon for a wireless test of the second integrated circuit die.

5. The apparatus of claim 3, wherein the at least one programmable element of the radio frequency selector of the first integrated circuit die comprises a fusible link.

6. The apparatus of claim 1, wherein the radio frequency selector of the first integrated circuit die includes a plurality of circuit branches, wherein each circuit branch of the plurality of circuit branches is configured to provide one bit of a binary code for selecting among the plurality of radio frequencies for configuring the radio frequency selector.

7. The apparatus of claim 1, wherein the radio frequency selector of the first integrated circuit die includes a plurality of circuit branches, wherein each circuit branch of the plurality of circuit branches is configured to provide one bit of a binary code corresponding to one of the plurality of radio frequencies.

8. The apparatus of claim 1, wherein the radio frequency selector of the first integrated circuit die includes a plurality of circuit branches, wherein each circuit branch of the plurality of circuit branches comprises a fusible link having a first terminal connected to a power supply distribution line, and a second terminal coupled to a pull-down circuit.

9. The apparatus of claim 8, wherein a second terminal of each fusible link provides an output voltage signal whose value is indicative of a bit stored in the circuit branch.

10. The apparatus of claim 1, wherein the wireless probe card further comprises a control circuit configured to manage test signals exchanged between the wireless probe card and a tester.

11. The apparatus of claim 1, wherein the first wireless unit comprises a first transceiver circuit configured to transmit wireless signals at the first frequency.

12. The apparatus of claim 11, wherein the first transceiver circuit is physically coupled to a first antenna on the wireless probe card.

13. A method, comprising:

positioning a wireless probe card in proximity to a single wafer including a plurality of integrated circuit dies under test, wherein the wireless probe card includes a plurality of wireless units, each of the plurality of wireless units operable to communicate using a different radio frequency than each other of the plurality of wireless units;

programming a radio frequency selector for each integrated circuit die of the plurality of different integrated circuit dies under test to operate at a certain radio frequency, wherein the certain radio frequency matches one of the different radio frequencies used by a corresponding wireless unit of the plurality of wireless units; and

engaging in communication between each wireless unit and the corresponding integrated circuit die to perform testing of the integrated circuit die.

14. The method of claim 13, wherein programming comprises programming at least one programmable element of the radio frequency selector for each integrated circuit die of the plurality of integrated circuit dies to store an indication of the radio frequency.

15. The method of claim 14, wherein programming the at least one programmable element of the radio frequency selector for each of the plurality of different integrated circuit dies comprises burning selected fusible links of a plurality of different circuit branches, each fusible link adapted to provide one bit of a binary code corresponding to the radio frequency.

16. The method of claim 13,

wherein the single wafer comprises first and second integrated circuit dies under test;

wherein the plurality of wireless units comprises first and second wireless units;

wherein the first wireless unit is operable to communicate using a first radio frequency;

wherein the second wireless unit is operable to communicate using a second radio frequency different than the first radio frequency; and

wherein programming the radio frequency selector for each integrated circuit die of the plurality of different integrated circuit dies under test to operate at a certain radio frequency comprises programming the radio frequency selector for the first integrated circuit die to operate at the first radio frequency and programming the radio frequency selector for the second integrated circuit die to operate at the second radio frequency; and

wherein engaging in communication between each wireless unit and the corresponding integrated circuit die to perform testing of the integrated circuit die comprises engaging in communication between the first wireless unit and the first integrated circuit die at the first radio frequency to perform testing of the first integrated circuit die and engaging in communication between the second wireless unit and the second integrated circuit die at the second radio frequency to perform testing of the second integrated circuit die.