“4H” X-ray camera

• US 10,641,912 B1
• Filed: 06/14/2017
• Issued: 05/05/2020
• Est. Priority Date: 06/15/2016
• Status: Active Grant

• Current Assignee: TRIAD National Security, LLC
• Original Assignee: TRIAD National Security, LLC
• Inventors: Wang, Zhehui
• Primary Examiner(s): Jo, Taeho
• Application Number:
  US15/622,557
• Time in Patent Office: 1,056 Days
• Field of Search: 25037009
• CPC Class Codes: G01T 1/24 with semiconductor detectors
• CPC Class Codes: G01T 1/247 Detector read-out circuitry for processing gain or off-set correction H04N
• CPC Class Codes: G01T 1/2928 using solid state detectors
• CPC Class Codes: H01L 27/14661 of the hybrid type
• CPC Class Codes: H01L 31/0304 including, apart from doping materials or other impurities, only AIIIBV compounds

Abstract

A 4H X-ray camera includes a high speed, high atomic number (Z), high spatial resolution sensor for sensing X-rays having energy over 30 keV and high speed readout electronics, and the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics.

Claims

1. A 4H X-ray camera comprising:

a high speed, high atomic number (Z), high spatial resolution sensor for sensing X-rays having energy over 30 keV coupled with a low Z sensor; and

high speed readout electronics,

wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics,

wherein the high speed, high atomic number (Z), high spatial resolution sensor and the high speed readout electronics are in a same plane of incidence of incoming X-rays and the high speed readout electronics are spaced from the high speed, high atomic number (Z) high spatial resolution sensor in the same plane, and

wherein the high speed, high atomic number (Z), high spatial resolution sensor is different in thickness from the low Z sensor.

2. The 4H X-ray camera of claim 1, wherein the high speed, high atomic number (Z), high spatial resolution sensor comprises high-resistivity Chromium-doped GaAs sensor arrays.

3. The 4H X-ray camera of claim 1, wherein the high speed readout electronics comprises nano-second Application Specific Integrated Circuits (ASICs).

4. The 4H X-ray camera of claim 1, wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics utilizing bump bonding.

5. The 4H X-ray camera of claim 1, wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics utilizing wire bonding.

6. The 4H X-ray camera of claim 1, wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics utilizing 3D integration technology.

7. The 4H X-ray camera of claim 1, wherein the high speed, high atomic number (Z), high spatial resolution sensor comprises a material with at least one element with an atomic number greater than thirty.

8. The 4H X-ray camera of claim 1, further comprising:

a second sensor in line with the high speed, high atomic number (Z), high spatial resolution sensor, the second sensor being the low Z sensor,

wherein the high speed readout electronics are divided into four parts, each part being coupled to a respective half of one of the high speed, high atomic number (Z), high spatial resolution sensor or the second sensor.

9. The 4H X-ray camera of claim 8, further comprising:

a first tier comprising the high speed, high atomic number (Z), high spatial resolution sensor, the second sensor, and the high speed readout electronics; and

a second tier comprising a third sensor, a fourth sensor, and second high speed readout electronics, the third sensor and the fourth sensor being in line with the high speed, high atomic number (Z), high spatial resolution sensor and the second sensor.

10. A 4H X-ray camera comprising:

a plurality of tiers, each tier comprising;

a high speed, high atomic number (Z), high spatial resolution sensor for sensing X-rays having energy over 30 keV coupled with a low Z sensor; and

high speed readout electronics, the high speed readout electronics being spaced from the high speed, high atomic number (Z) high spatial resolution sensor in a same plane,

wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics, and

wherein the low Z sensor is located to sense incoming X-rays after the incoming X-rays pass through the high speed, high atomic number (Z), high spatial resolution sensor.

11. The 4H X-ray camera of claim 10, wherein the high speed, high atomic number (Z), high spatial resolution sensor is coupled to the high speed readout electronics utilizing 3D integration technology.

12. The 4H X-ray camera of claim 10, wherein each of the high speed, high atomic number (Z), high spatial resolution sensors comprises high-resistivity Chromium-doped GaAs sensor arrays.

13. The 4H X-ray camera of claim 10, wherein each of the high speed readout electronics comprises nano-second Application Specific Integrated Circuits (ASICs).

14. The 4H X-ray camera of claim 10, wherein each of the high speed, high atomic number (Z), high spatial resolution sensors comprises a material with at least one element with an atomic number greater than thirty.

15. The 4H X-ray camera of claim 10, wherein each of the tiers further comprises:

a second sensor in line with the high speed, high atomic number (Z), high spatial resolution sensor, the second sensor being the low Z sensor,

wherein the high speed readout electronics, of each of the tiers, is divided into four parts, each part being coupled to a respective half of one of the high speed, high atomic number (Z), high spatial resolution sensor or the second sensor, the high speed, high atomic number (Z), high spatial resolution sensor and each of the four parts of the high speed readout electronics of each tier being in a same plane of incidence of incoming X-rays.

16. The 4H X-ray camera of claim 15, wherein the high speed, high atomic number (Z), high spatial resolution sensor and the second sensor are coupled to the high speed readout electronics, within each of the tiers, utilizing transmission lines.

17. The 4H X-ray camera of claim 10,

wherein the high speed, high atomic number (Z), high spatial resolution sensor, in each of the tiers, is in-line with its corresponding high speed readout electronics, and

wherein each of the plurality of tiers is in-line with each other of the plurality of tiers.

18. The 4H X-ray camera of claim 17, wherein each of the high speed, high atomic number (Z), high spatial resolution sensors is 100 μ

m thick.

19. The 4H X-ray camera of claim 17, wherein each of the high speed readout electronics is 100 μ

m thick.

20. A method of capturing an X-ray image utilizing a 4H X-ray camera, the method comprising:

receiving an X-ray with energy over 30 keV at a high speed, high atomic number (Z), high spatial resolution sensor coupled with a low Z sensor of the 4H X-ray camera;

generating and transferring an electric signal from the high speed, high atomic number (Z), high spatial resolution sensor coupled with the low Z sensor to high speed readout electronics of the 4H X-ray camera; and

generating an image based on the electric signal received at the high speed readout electronics,

wherein the image has a resolution having a pixel size of 200 microns or less,

wherein an operating speed of the 4H X-ray camera is 100 MHZ or greater,

wherein the high speed, high atomic number (Z), high spatial resolution sensor comprises a material with an atomic number greater than thirty, and

wherein the high speed, high atomic number (Z), high spatial resolution sensor and the high speed readout electronics are in a same plane of incidence of incoming X-rays and the high speed readout electronics are spaced from the high speed, high atomic number (Z) high spatial resolution sensor in the same plane.