Methods of forming photonic devices
First Claim
Patent Images
1. A method, comprising:
- forming a first etch stop layer over a substrate;
forming a first mask layer over the first etch stop layer;
forming a second etch stop layer over the first mask layer;
forming a second mask layer over the second etch stop layer;
forming two or more first recessed regions that each extends through the second mask layer;
forming a second recessed region, directly below a first one of the two or more first recessed regions, that further extends through the second etch stop layer and the first mask layer; and
concurrently forming first and second trenches with respective different depths in the substrate according to a second one of the two or more first recessed regions and the second recessed region.
0 Assignments
0 Petitions
Accused Products
Abstract
A method includes: forming a first plurality of tiers that each comprises first and second dummy layers over a substrate, wherein within each tier, the second dummy layer is disposed above the first dummy layer; forming a second plurality of recessed regions in the first plurality of tiers, wherein at least one subgroup of the second plurality of recessed regions extend through respective different numbers of the second dummy layers; and performing an etching operation to concurrently forming a third plurality of trenches with respective different depths in the substrate through the at least one subgroup of the second plurality of recessed regions.
-
Citations
15 Claims
-
1. A method, comprising:
-
forming a first etch stop layer over a substrate; forming a first mask layer over the first etch stop layer; forming a second etch stop layer over the first mask layer; forming a second mask layer over the second etch stop layer; forming two or more first recessed regions that each extends through the second mask layer; forming a second recessed region, directly below a first one of the two or more first recessed regions, that further extends through the second etch stop layer and the first mask layer; and concurrently forming first and second trenches with respective different depths in the substrate according to a second one of the two or more first recessed regions and the second recessed region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method, comprising:
-
forming a first tier over a substrate, the first tier including a first etch stop layer and a first mask layer formed over the etch stop layer; forming a second tier over first tier, the second tier including a second etch stop layer and a second mask layer formed over the second etch stop layer; forming a third tier over second tier, the third tier including a third etch stop layer and a third mask layer formed over the third etch stop layer; forming a first recessed region that extends through the first mask layer; forming a second recessed region that extends through the first mask layer, the first etch stop layer and the second mask layer; forming a third recessed region that extends through the first mask layer, the first etch stop layer, the second mask layer, the second etch stop layer and the third mask layer; forming a first trench through the first recessed region, the first trench extending into the substrate to a first depth; forming a second trench through the second recessed region, the second trench extending into the substrate to a second depth greater than the first depth; and forming a third trench through the third recessed region, the third trench extending into the substrate to a third depth greater than the second depth. - View Dependent Claims (10, 11, 12, 13, 14, 15)
-
Specification