Optical subassembly with detachably-coupling holder

• US 10,641,977 B2
• Filed: 04/12/2019
• Issued: 05/05/2020
• Est. Priority Date: 04/13/2018
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Wang, William H., Peng, Huaping, Zhang, Ranran, Mao, Yandong, Shi, Shamei
• Primary Examiner(s): Jordan, Andrew
• Application Number:
  US16/383,027
• Publication Number:
  US 20190317283A1
• Time in Patent Office: 389 Days
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4233 Active alignment along the optical axis and passive alignment perpendicular to the optical axis
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G02B 6/4261 Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

An example optoelectronic module may include an optical subassembly (OSA), an optical port block, a housing, and a holder. The OSA may be configured to convert between optical and electrical signals. The optical port block may be attached to the OSA and may be configured to optically align a fiber optic cable with the OSA. The housing may be configured to substantially enclose the OSA and the optical port block. The holder may be configured to couple the OSA and the optical port block to the housing. The holder may be detachably coupled to the optical port block and fixedly coupled to the housing.

Claims

1. An optoelectronic module comprising:

an optical subassembly (OSA) configured to convert between optical and electrical signals;

an optical port block attached to the OSA, the optical port block configured to optically align a fiber optic cable with the OSA;

a housing configured to substantially enclose the OSA and the optical port block; and

a holder configured to couple the OSA and the optical port block to the housing, wherein the holder is detachably coupled to the optical port block and fixedly coupled to the housing.

2. The optoelectronic module of claim 1, wherein the holder is fixedly coupled to the housing after assembly of the optoelectronic module and wherein during assembly of the optoelectronic module, the holder is floatably coupled to the housing.

3. The optoelectronic module of claim 2, wherein the holder is fixedly coupled to the housing after assembly by cured epoxy and wherein the holder is floatably coupled to the housing during assembly by uncured epoxy.

4. The optoelectronic module of claim 1, wherein the OSA is removable from the optoelectronic module without destruction of the OSA.

5. The optoelectronic module of claim 1, wherein the optical port block is fixedly coupled to the OSA and is removable from the optoelectronic module with the OSA without destruction of the optical port block.

6. An optoelectronic module comprising:

an assembly that includes an optical subassembly (OSA) and an optical port block fixedly attached to the OSA, the OSA configured to convert between optical and electrical signals and the optical port block configured to optically align a fiber optic cable with the OSA;

a housing configured to substantially enclose the assembly; and

at least one holder configured to couple the assembly to the housing, wherein the at least one holder detachably couples on a first end to the assembly and floatably couples on a second end to the housing while the housing is assembled to exert balanced forces on the OSA and fixedly couples on the second end to the housing after the housing is assembled around the assembly.

7. The optoelectronic module of claim 6, wherein the assembly is mechanically and electrically compliant with one of a SFP+ standard, an XFP standard, or a QSFP standard.

8. The optoelectronic module of claim 6, wherein the at least one holder detachably couples on the first end to the assembly using one or more screws.

9. The optoelectronic module of claim 6, wherein the at least one holder floatably couples on the second end to the housing using uncured epoxy while the housing is assembled.

10. The optoelectronic module of claim 9, wherein the at least one holder fixedly couples on the second end to the housing by curing the uncured epoxy.

11. The optoelectronic module of claim 6, further comprising at least one thermal pad placed between the OSA and the housing.

12. The optoelectronic module of claim 6, wherein:

the OSA is removable from the optoelectronic module without destruction of the OSA;

or

the assembly is removable from the optoelectronic module without destruction of the assembly.

13. A method, comprising:

coupling an optical subassembly (OSA) to an optical port block to form an assembly, the optical port block optically aligned with the OSA;

detachably coupling at least one holder to the optical port block;

floatably coupling the at least one holder to at least a portion of a housing of an optoelectronic module, the housing configured to substantially enclose the assembly;

enclosing the assembly with the housing; and

fixedly coupling the at least one holder to the at least a portion of the housing after the housing is assembled around the assembly.

14. The method of claim 13, wherein:

coupling the OSA to the optical port block comprises fixedly coupling the OSA to the optical port block;

enclosing the assembly with the housing includes exerting forces on the assembly; and

the assembly moves as a single unit responsive to the exerted forces such that the OSA and the optical port block remain optically aligned.

15. The method of claim 13, wherein the detachably coupling the at least one holder to the optical port block comprises coupling the at least one holder to the optical port block using one or more screws.

16. The method of claim 13, wherein the floatably coupling the at least one holder comprises coupling the at least one holder to the housing using uncured epoxy.

17. The method of claim 16, wherein the fixedly coupling the at least one holder comprises curing the uncured epoxy after the enclosing the assembly.

18. The method of claim 13, further comprising placing at least one thermal pad between the OSA and the housing.

19. The method of claim 13, further comprising salvaging the OSA or the assembly from the optoelectronic module.

20. The method of claim 13, wherein the salvaging comprises removing the OSA or the assembly from the optoelectronic module without destroying the OSA or the assembly.