Reflective mask blank, reflective mask and method of manufacturing semiconductor device
First Claim
Patent Images
1. A reflective mask blank comprising:
- a substrate;
a multilayer reflective film on the substrate; and
a phase shift film that shifts a phase of extreme ultra violet (EUV) light on the multilayer reflective film;
wherein,root mean square roughness (Rms), obtained by measuring a 1 μ
m×
1 μ
m region on a surface of the phase shift film with an atomic force microscope, is not more than 0.50 nm, and an integrated value of power spectrum density at a spatial frequency of 10 to 100 μ
m−
is not more than 360 nm3.
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Abstract
A reflective mask blank capable of obtaining high contrast at the edges of a phase shift film pattern. Provided is a reflective mask blank comprising a multilayer reflective film and a phase shift film that shifts the phase of EUV light formed in that order on a substrate, wherein root mean square roughness (Rms), obtained by measuring a 1 μm×1 μm region on the surface of the phase shift film with an atomic force microscope, is not more than 0.50 nm, and power spectrum density at a spatial frequency of 10 to 100 μm−1 is not more than 17 nm4.
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Citations
20 Claims
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1. A reflective mask blank comprising:
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a substrate; a multilayer reflective film on the substrate; and a phase shift film that shifts a phase of extreme ultra violet (EUV) light on the multilayer reflective film;
wherein,root mean square roughness (Rms), obtained by measuring a 1 μ
m×
1 μ
m region on a surface of the phase shift film with an atomic force microscope, is not more than 0.50 nm, and an integrated value of power spectrum density at a spatial frequency of 10 to 100 μ
m−
is not more than 360 nm3. - View Dependent Claims (2, 3, 4, 5)
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6. A reflective mask comprising:
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a substrate; a multilayer reflective film on the substrate; and a phase shift film pattern that shifts a phase of extreme ultra violet (EUV) light on the multilayer reflective film;
wherein,root mean square roughness (Rms), obtained by measuring a 1 μ
m×
1 μ
m region on a surface of the phase shift film pattern with an atomic force microscope, is not more than 0.50 nm, and an integrated value of power spectrum density at a spatial frequency of 10 to 100 μ
m−
is not more than 360 nm3. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a semiconductor device comprising:
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carrying out a lithography process with an exposure device using a reflective mask to form a transfer pattern on a transferred substrate, the reflective mask comprising; a reflective mask substrate; a multilayer reflective film on the reflective mask substrate; and a phase shift film pattern that shifts a phase of extreme ultra violet (EUV) light formed on the multilayer reflective film;
wherein,root mean square roughness (Rms), obtained by measuring a 1 μ
m×
1 μ
m region on a surface of the phase shift film pattern with an atomic force microscope, is not more than 0.50 nm, and an integrated value of power spectrum density at a spatial frequency of 10 to 100 μ
m−
is not more than 360 nm3. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification