Cover for devices

• US 10,642,324 B2
• Filed: 04/06/2016
• Issued: 05/05/2020
• Est. Priority Date: 04/06/2016
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Wu, Kuan-Ting, Li, Ai-Tsung, Yeh, Ya-Ting, Voss, Kevin, Delpier, Michael
• Primary Examiner(s): Polley, Christopher M
• Application Number:
  US16/067,766
• Publication Number:
  US 20190025895A1
• Time in Patent Office: 1,490 Days
• Field of Search: None
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/1633 Protecting arrangement for the entire housing of the computer
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

Claims

1. A cover for a device, the cover comprising:

a substrate to be placed in proximity to a heat source of the device;

a heat resistant layer applied over a surface of the substrate to insulate heat generated by the heat source, wherein the heat resistant layer comprises;

a heat resistant powder layer disposed over the surface of the substrate,

a heat resistant primer layer disposed over the heat resistant powder layer, and

a heat resistant spray base layer disposed over the heat resistant primer layer; and

a top layer applied over one of the heat resistant layer or another surface of the substrate, the another surface being opposite to the surface having the heat resistant layer, to provide at least one of chemical resistant properties or aesthetic properties.

2. The cover as claimed in claim 1, wherein the heat resistant layer comprises a heat resistant base layer, the heat resistant base layer including a heat resistant powder layer, a heat resistant spray layer, and the heat resistant spray layer disposed over the heat resistant powder layer.

3. The cover as claimed in claim 1, wherein the heat resistant layer comprises:

a heat resistant primer layer disposed over the surface of the substrate; and

a heat resistant spray base layer disposed over the heat resistant primer layer.

4. The cover as claimed in claim 1, wherein the heat resistant layer comprises at least one of mineral-based insulators, fiber-glass based insulators, cellular glass based insulators, cellulose-based insulators, polymeric foam-based insulators, polymeric resin-based insulators, or silica-based insulators.

5. The cover as claimed in claim 1, wherein the substrate is one of a metal, a metal alloy, a polymer, a carbon fiber, a ceramic, or a composite material.

6. The cover as claimed in claim 1, wherein the top layer comprises at least one of a hydrophobic layer, an antibacterial layer, an anti-smudge layer, a surface texture layer, or a color layer.

7. The cover as claimed in claim 1, wherein a thickness of the top layer is in a range of about 15 micrometer (μ

m) to about 60 μ

m, and a thickness of the heat resistant layer is in a range of about 20 μ

m to 640 μ

m.

8. The cover as claimed in claim 1, wherein the heat resistant layer comprises at least one of carbon black, carbon nanotubes (CNT), graphene, graphite, titanium dioxide, aluminum oxide, barium sulfate, calcium carbonate, clay, mica, dyes, synthetic pigments, talc, metallic powders, organic powders, color pigments or inorganic powders.

11. A method to fabricate the cover for a device of claim 1, the cover being heat insulating and including an inner surface to face a heat source of the device, and an outer surface opposite to the inner surface, wherein the method comprises:

applying the heat resistant coating on one of the inner surface or the outer surface to form a heat resistant layer, the heat resistant layer to insulate heat generated by the heat source; and

applying the top coating over one of the heat resistant layer or the outer surface to provide for at least one of chemical resistant properties or aesthetic properties, the top coating being applied on the outer surface, when the heat resistant layer is applied over the inner surface.

12. The method as claimed in claim 11, wherein the method further comprises surface treating one of the inner surface or the outer surface of the cover prior to applying the heat resistant coating, wherein a type of the surface treatment is based on a material of the cover.

9. A device comprising:

a component set generating heat during operation of the device; and

a cover to insulate the heat generated by the component set, the cover comprising,

an inner surface facing the component set;

an outer surface opposite the inner surface;

a heat resistant layer disposed over one of the inner surface or the outer surface to insulate the heat generated by the component set, wherein the heat resistant layer comprises;

a heat resistant powder layer disposed over the surface of the substrate,

a heat resistant primer layer disposed over the heat resistant powder layer, and

a heat resistant spray base layer disposed over the heat resistant primer layer; and

a top layer to provide at least one of chemical resistant properties or aesthetic properties to the cover, the top layer being disposed over one of;

the outer surface;

or

the heat resistant layer, when the heat resistant layer is disposed over the outer surface.

10. The device as claimed in claim 9, wherein the heat resistant layer comprises at least one of a heat resistant base layer, the heat resistant base layer including a heat resistant powder layer, a heat resistant spray layer, or the heat resistant spray layer disposed over the heat resistant powder layer.