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Semiconductor chip including integrated security circuit

  • US 10,643,006 B2
  • Filed: 06/14/2017
  • Issued: 05/05/2020
  • Est. Priority Date: 06/14/2017
  • Status: Active Grant
First Claim
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1. A method of fabricating an authentic integrated circuit, the method comprising:

  • forming an integrated circuit on a substrate;

    placing a plurality of individual security parts on a white space of the substrate that excludes the integrated circuit, the plurality of individual security parts defining at least one security circuit, each security part being completely separated from one another and dispersed at a different white space locations of the substrate so as to separate the security circuit into segments; and

    programming at least one security part among the plurality of individual security parts with key code data so as to program the at least one security circuit with a key code,wherein the individual security parts include e-fuses.

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