System and method to estimate a number of layers needed for routing a multi-die package

• US 10,643,020 B1
• Filed: 01/02/2019
• Issued: 05/05/2020
• Est. Priority Date: 01/02/2019
• Status: Active Grant

• Current Assignee: Cadence Design Systems Incorporated (Cadence Group)
• Original Assignee: Cadence Design Systems Incorporated (Cadence Group)
• Inventors: Kukal, Taranjit Singh, Singh, Surender, Jacob, Jitin, Rakra, Navkamal
• Primary Examiner(s): Chiang, Jack
• Assistant Examiner(s): Bowers, Brandon
• Application Number:
  US16/238,257
• Time in Patent Office: 489 Days
• Field of Search: 716 52
• CPC Class Codes: G06F 2113/18 Chip packaging
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: G06F 30/394 Routing G06F30/396 takes precedence
• CPC Class Codes: G06F 30/398 Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] optical proximity correction [OPC] design processes G03F1/36

Abstract

Embodiments included herein are directed towards a system and method for implementing an IC package design with an IC package design estimator. Embodiments may include estimating a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs. Embodiments may further include determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs. Embodiments may also include identifying a number of layers required to perform routing between each of the plurality of IC die designs. Embodiments may further include determining a power layer or ground layer based upon, at least in part, one or more factors and generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

Claims

1. A computer implemented method for implementing an IC package design with an IC package design estimator, comprising:

estimating, using at least one processor, a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs;

determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs;

identifying a number of layers required to perform routing between each of the plurality of IC die designs;

combining the plurality of IC die designs into a single die design;

determining a power layer or ground layer based upon, at least in part, one or more factors; and

generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

2. The method of claim 1, wherein determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs includes performing a maze-routing analysis based upon, at least in part, a worst case number of layers required to fan-out each of the plurality of IC die designs.

3. The method of claim 1, wherein identifying the number of layers required to perform routing between each of the plurality of IC die designs includes performing a graph-based analysis including a point-to-point routing determination between each of the plurality of IC die designs.

4. The method of claim 1, wherein the one or more factors include at least one of heat dissipation and a quantity of power supplies.

5. The method of claim 1, further comprising:

routing a plurality of interconnections between the single die design and one or more a plurality of ball-grid-array (“

BGA”

) interfaces.

6. The method of claim 1, further comprising:

displaying, at a graphical user interface, a user editable display configured to allow a user to set one or more constraints prior to estimating or identifying.

7. The method of claim 1, further comprising:

displaying, at a graphical user interface, one or more routes or one or more routing guidelines.

8. The method of claim 1, further comprising:

generating at least one of a stack-up and fan-out guidelines; and

optimizing the stack-up using a package layout estimator.

9. The method of claim 1, wherein the output includes a visualization of at least one of a stack-up, a via library to be used for the stack-up, one or more fan-out guidelines, one or more guidelines on point-point routing between the plurality of IC die designs, and one or more guidelines on power-plane design.

10. A system for implementing an IC package design with an IC package design estimator, comprising:

at least one processor configured to estimate a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs, the at least one processor further configured to determine whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs, the at least one processor further configured to identify a number of layers required to perform routing between each of the plurality of IC die designs, the at least one processor further configured to combine the plurality of IC die designs into a single die design, the at least one processor further configured to determine a power layer or ground layer based upon, at least in part, one or more factors and to generate an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

11. The system of claim 10, wherein determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs includes performing a maze-routing analysis based upon, at least in part, a worst case number of layers required to fan-out each of the plurality of IC die designs.

12. The system of claim 10, wherein identifying the number of layers required to perform routing between each of the plurality of IC die designs includes performing a graph-based analysis including a point-to-point routing determination between each of the plurality of IC die designs.

13. The system of claim 10, wherein the one or more factors include at least one of heat dissipation and a quantity of power supplies.

14. The system of claim 10, wherein the at least one processor is further configured to:

routing a plurality of interconnections between the single die design and a plurality of ball-grid-array (“

BGA”

) interfaces.

15. The system of claim 10, wherein the at least one processor is further configured to:

displaying, at a graphical user interface, a user editable display configured to allow a user to set one or more constraints prior to estimating or identifying.

16. The system of claim 10, wherein the at least one processor is further configured to:

displaying, at a graphical user interface, one or more routes or one or more routing guidelines.

17. The system of claim 10, wherein the at least one processor is further configured to:

generating at least one of a stack-up and fan-out guidelines; and

optimizing the stack-up using a package layout estimator.

18. The system of claim 10, wherein the output includes a visualization of at least one of a stack-up, a via library to be used for the stack-up, one or more fan-out guidelines, one or more guidelines on point-point routing between the plurality of IC die designs, and one or more guidelines on power-plane design.

19. A non-transitory computer readable storage medium having stored thereon instructions, which when executed by a processor result in one or more operations, the operations comprising:

estimating, using at least one processor, a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs;

determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs;

identifying a number of layers required to perform routing between each of the plurality of IC die designs;

combining the plurality of IC die designs into a single die design;

determining a power layer or ground layer based upon, at least in part, one or more factors; and

generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

20. The non-transitory computer readable medium of claim 19, wherein determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs includes performing a maze-routing analysis based upon, at least in part, a worst case number of layers required to fan-out each of the plurality of IC die designs.