Bonded semiconductor structures
First Claim
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1. A method, comprising:
- after forming an ion-implanted layer which is in contact with and disposed between an epitaxial layer and a first semiconductor substrate, without forming any layer on the epitaxial layer, bonding the epitaxial layer to a second semiconductor substrate; and
splitting the ion-implanted layer to separate the first semiconductor substrate with a portion of the ion-implanted layer from a remaining portion of the ion-implanted layer with the epitaxial layer completely.
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Abstract
A method is disclosed that includes operations as follows. With an ion-implanted layer which is disposed between an epitaxial layer and a first semiconductor substrate, the epitaxial layer is bonded directly to a second semiconductor substrate. The ion-implanted layer is split to separate the first semiconductor substrate from the epitaxial layer completely.
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Citations
20 Claims
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1. A method, comprising:
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after forming an ion-implanted layer which is in contact with and disposed between an epitaxial layer and a first semiconductor substrate, without forming any layer on the epitaxial layer, bonding the epitaxial layer to a second semiconductor substrate; and splitting the ion-implanted layer to separate the first semiconductor substrate with a portion of the ion-implanted layer from a remaining portion of the ion-implanted layer with the epitaxial layer completely. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method, comprising:
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after forming an ion-implanted layer which is in contact with and disposed between an epitaxial layer and a first semiconductor substrate, bonding the epitaxial layer to a bonding oxide layer of a second semiconductor substrate without forming any layer on the epitaxial layer such that the epitaxial layer is in contact with the bonding oxide layer of the second semiconductor substrate; splitting the ion-implanted layer to remove the first semiconductor substrate together with a portion of the ion-implanted layer, with the epitaxial layer being remained; and forming a first semiconductor device portion on the remained epitaxial layer, and an interconnect layer on the first semiconductor device portion. - View Dependent Claims (14, 15, 16, 17)
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18. A method, comprising:
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after forming an ion-implanted layer which is in contact with and disposed between an epitaxial layer and a first semiconductor substrate, without forming any layer on the epitaxial layer, bonding the epitaxial layer to a bonding oxide layer of a second semiconductor substrate such that the epitaxial layer is in contact with the bonding oxide layer of the second semiconductor substrate; splitting the ion-implanted layer to remove the first semiconductor substrate together with a portion of the ion-implanted layer, with the epitaxial layer being remained; forming a first semiconductor device portion on the remained epitaxial layer; forming vias through the first semiconductor device portion and the epitaxial layer; and forming an interconnect layer on the first semiconductor device portion. - View Dependent Claims (19, 20)
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Specification