Methods for making multi-die package with bridge layer
First Claim
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1. A method, comprising:
- patterning a second substrate to form a plurality of trenches;
depositing an isolation layer over the second substrate;
removing portions of the second substrate to form a bridge layer, wherein the portions of the second substrate that are removed are defined at least in part by sidewalls of the plurality of trenches;
attaching the bridge layer to a first substrate, wherein after the bridge layer is attached to the first substrate the bridge layer comprises a plurality of first bond pads on a surface of the bridge layer that opposes the first substrate, the first substrate comprises a plurality of second bond pads disposed on a surface of the first substrate facing the bridge layer, and the plurality of second bond pads is positioned outside of a lateral extent of the bridge layer;
electrically connecting a first bond pad of the plurality of first bond pads to a second bond pad of the plurality of second bond pads using a first connector;
coupling a first die to the bridge layer using the plurality of first bond pads and to the first substrate using the plurality of second bond pads; and
coupling a second die to the bridge layer.
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Abstract
A method is provided. The method includes attaching a bridge layer to a first substrate. The method also includes forming a first connector, the first connector electrically connecting the bridge layer to the first substrate. The method also includes coupling a first die to the bridge layer and the first substrate, and coupling a second die to the bridge layer.
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Citations
20 Claims
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1. A method, comprising:
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patterning a second substrate to form a plurality of trenches; depositing an isolation layer over the second substrate; removing portions of the second substrate to form a bridge layer, wherein the portions of the second substrate that are removed are defined at least in part by sidewalls of the plurality of trenches; attaching the bridge layer to a first substrate, wherein after the bridge layer is attached to the first substrate the bridge layer comprises a plurality of first bond pads on a surface of the bridge layer that opposes the first substrate, the first substrate comprises a plurality of second bond pads disposed on a surface of the first substrate facing the bridge layer, and the plurality of second bond pads is positioned outside of a lateral extent of the bridge layer; electrically connecting a first bond pad of the plurality of first bond pads to a second bond pad of the plurality of second bond pads using a first connector; coupling a first die to the bridge layer using the plurality of first bond pads and to the first substrate using the plurality of second bond pads; and coupling a second die to the bridge layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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patterning a second substrate to form a trench; depositing an isolation material on the second substrate, the isolation material coating sidewalls of the trench; removing portions of the second substrate to form a bridge, a sidewall of the bridge being defined by a sidewall of the trench; adhering the bridge to a first substrate; coupling a first connector to a first bond pad on the bridge and to a second bond pad on the first substrate; attaching a first die to the bridge and to the first substrate using second connectors and third connectors, the second connectors extending between the first die and the first substrate, the third connectors extending between the first die and the bridge, wherein a thickness of the second connectors is larger than a thickness of the third connectors; injecting a first underfill into spaces surrounding the second connectors and the third connectors, the first underfill contacting the first die and the first substrate; and attaching a second die to the bridge, the bridge extending laterally past opposite sidewalls of the second die. - View Dependent Claims (11, 12, 13, 14)
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15. A method, comprising:
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forming a bridge, the bridge having a plurality of first bond pads on a first surface of the bridge, wherein forming the bridge comprises; patterning a second substrate to form a trench; depositing an isolation material on the second substrate, the isolation material coating sidewalls of the trench; and removing portions of the second substrate to form a bridge, a sidewall of the bridge being defined by a sidewall of the trench; coupling the bridge to a first substrate, the first surface of the bridge facing away from the first substrate; forming a first connector, the first connector electrically connecting a first bond pad of the plurality of first bond pads to a second bond pad disposed on a second surface of the first substrate, the first connector being external to the bridge and extending along a sidewall of the bridge; after forming the first connector, coupling a first die to the first substrate and the bridge, the first die overlying a sidewall of the bridge; and coupling a second die to the bridge. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification