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Methods for making multi-die package with bridge layer

  • US 10,643,861 B2
  • Filed: 05/01/2017
  • Issued: 05/05/2020
  • Est. Priority Date: 09/30/2014
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • patterning a second substrate to form a plurality of trenches;

    depositing an isolation layer over the second substrate;

    removing portions of the second substrate to form a bridge layer, wherein the portions of the second substrate that are removed are defined at least in part by sidewalls of the plurality of trenches;

    attaching the bridge layer to a first substrate, wherein after the bridge layer is attached to the first substrate the bridge layer comprises a plurality of first bond pads on a surface of the bridge layer that opposes the first substrate, the first substrate comprises a plurality of second bond pads disposed on a surface of the first substrate facing the bridge layer, and the plurality of second bond pads is positioned outside of a lateral extent of the bridge layer;

    electrically connecting a first bond pad of the plurality of first bond pads to a second bond pad of the plurality of second bond pads using a first connector;

    coupling a first die to the bridge layer using the plurality of first bond pads and to the first substrate using the plurality of second bond pads; and

    coupling a second die to the bridge layer.

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