Diodes offering asymmetric stability during fluidic assembly

• US 10,643,870 B2
• Filed: 05/22/2019
• Issued: 05/05/2020
• Est. Priority Date: 06/23/2016
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Schuele, Paul John, Heine, David Robert, Crowder, Mark Albert, Garner, Sean Mathew, Zhan, Changqing, Shinde, Avinash Tukaram, Sasaki, Kenji Alexander, Ulmer, Kurt Michael
• Primary Examiner(s): Gebreyesus, Yosef
• Application Number:
  US16/420,097
• Publication Number:
  US 20190273006A1
• Time in Patent Office: 349 Days
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95123 by applying a pressurised fluid flow, e.g. liquid or gas flow
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Claims

1. A method for assembling a display device, the method comprising:

providing a substrate, wherein the substrate includes at least one groove extending blow a top surface of the substrate;

providing a suspension including a carrier liquid and a plurality of post enhanced diodes, wherein each of the post enhanced diodes includes a post extending from a top surface of a diode structure; and

orienting the plurality of post enhanced diodes in relation to the top surface of the substrate by flowing the suspension over the at least one groove in the top surface of the substrate, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a more likely non-inverted orientation, and wherein an orientation of each of a post enhanced diode where the post extends toward the substrate is a less likely inverted orientation.

2. The method of claim 1, wherein the at least one groove is configured such that a post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the non-inverted orientation is more mechanically stable than the post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the inverted orientation.

3. The method of claim 1, wherein the post is a non-metallic post.

4. The method of claim 1, wherein the post is a metallic post.

5. The method of claim 1, wherein the post is selected from a group consisting of:

a non-conductive post, and a conductive post.

6. The method of claim 1, wherein the substrate further includes a plurality of wells extending below the top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, the method further comprising:

flowing the suspension over the top surface of the substrate such that each of the of the plurality of wells is filled with a respective one of the plurality of post enhanced diodes in the non-inverted orientation.

7. The method of claim 6, wherein at least one sidewall of a line extending into the substrate is tapered.

8. The method of claim 1, wherein the at least one groove extends in a line across a portion of the substrate, and wherein the line is selected from a group consisting of:

a straight line, and a curvilinear line.

9. The method of claim 8, wherein at least one sidewall of the line extending into the substrate is substantially vertical.

10. A method for assembling a display device, the method comprising:

providing a substrate, wherein the substrate includes a plurality of wells extending into a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode;

providing a suspension including a carrier liquid and a plurality of post enhanced diodes, wherein each of the plurality of the post enhanced diodes includes a post extending from a top surface of a diode structure; and

orienting the plurality of post enhanced diodes in relation to the top surface of the substrate by flowing the suspension over the plurality of wells, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of a post enhanced diode where the post extends toward the substrate is an inverted orientation, wherein one of the plurality of post enhanced diodes deposited in a respective one of the plurality of wells is more mechanically stable in the non-inverted orientation than in the inverted orientation.

11. The method of claim 10, wherein the substrate further includes at least one groove extending into the top surface of the substrate, the method further comprising:

flowing the suspension over the at least one groove in the top surface of the substrate, wherein flowing past the at least one groove makes the non-inverted orientation more likely than the inverted orientation.

12. The method of claim 11, wherein the at least one groove is configured such that a post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the non-inverted orientation is more mechanically stable than the post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the inverted orientation.

13. The method of claim 11, wherein the at least one groove extends in a line across a portion of the substrate, and wherein the line is selected from a group consisting of:

a straight line, and a curvilinear line.

14. The method of claim 13, wherein at least one sidewall of the line extending into the substrate is tapered.

15. The method of claim 13, wherein at least one sidewall of the line extending into the substrate is substantially vertical.

16. The method of claim 10, wherein the post is a non-metallic post.

17. The method of claim 10, wherein the post is a metallic post.

18. The method of claim 10, wherein the post is a non-conductive post.

19. The method of claim 10, wherein the post is a conductive post.

20. The method of claim 10, the method further comprising:

flowing the suspension over the top surface of the substrate such that each of the of the plurality of wells is filled with a respective one of the plurality of post enhanced diodes in the non-inverted orientation.