Transfer head, transfer head array, and method for transfering inorganic light-emitting diode

• US 10,643,871 B2
• Filed: 10/30/2018
• Issued: 05/05/2020
• Est. Priority Date: 08/02/2018
• Status: Active Grant

• Current Assignee: Shanghai Tianma Micro-Electronics Company Limited (Tianma Microelectronics Company Limited)
• Original Assignee: Shanghai Tianma Micro-Electronics Company Limited (Tianma Microelectronics Company Limited)
• Inventors: He, Zeshang
• Primary Examiner(s): Booth, Richard A
• Application Number:
  US16/174,800
• Publication Number:
  US 20200043760A1
• Time in Patent Office: 553 Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/75303 of the pressing surface
• CPC Class Codes: H01L 2224/7531 of other parts
• CPC Class Codes: H01L 2224/75705 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A transfer head, a transfer head array, and a method for transferring an inorganic light-emitting diode are provided. The transfer head for transferring an inorganic light-emitting diode includes a first groove and a second groove. The first groove and the second groove are arranged sequentially in a first direction, and are connected to each other. The first groove is configured to provide an inlet and an outlet for the inorganic light-emitting diode to enter and exit the transfer head. After the inorganic light-emitting diode enters the second groove through the first groove, at least a partial structure of the inorganic light-emitting diode is confined in the second groove. Picking up and transferring the inorganic light-emitting diode is realized by the transfer head with a simple structure.

Claims

1. A transfer head, for transferring an inorganic light-emitting diode, the transfer head comprising a first groove and a second groove, wherein:

the first groove and the second groove are disposed sequentially in a first direction;

the first groove and the second groove are connected to each other;

the first groove is configured to provide an inlet/outlet for the inorganic light-emitting diode to enter and exit the transfer head; and

after the inorganic light-emitting diode enters the second groove through the first groove, at least a partial structure of the inorganic light-emitting diode is confined in the second groove.

2. The transfer head according to claim 1, wherein:

a minimum distance between two opposite inner sidewalls of the first groove along a second direction perpendicular to the first direction is a first distance of the first groove;

the inorganic light-emitting diode has a multi-layer stacking structure;

a third direction is perpendicular to a stacking direction of the multi-layer stacking structure;

a maximum distance between two opposite outer sidewalls of the inorganic light-emitting diode along the third direction is a second distance of the inorganic light-emitting diode; and

the first distance of the first groove is larger than the second distance of the inorganic light-emitting diode.

3. The transfer head according to claim 2, wherein:

a first cross section of the first groove is in parallel with the first direction and the second direction;

a second cross section of the inorganic light-emitting diode is perpendicular to the stacking direction of the multi-layer stacking structure; and

the first cross section of the first groove has a shape substantially same as a shape of the second cross section of the inorganic light-emitting diode.

4. The transfer head according to claim 3, wherein:

both the first cross section and the second cross section are circles or regular polygons.

5. The transfer head according to claim 2, wherein:

a minimum distance between two opposite inner sidewalls of the second groove along the second direction is a third distance of the second groove;

the third distance of the second groove is smaller than the second distance; and

a distance between a position of the second groove at the third distance and a bottom of the second groove is larger than 0.

6. The transfer head according to claim 5, wherein:

a third cross section of the second groove is perpendicular to the first direction;

the third cross section of the second groove is a trapezoid;

the trapezoid has two opposite parallel sides, including a long side and a short side; and

the long side of the trapezoid corresponds to the bottom of the second groove.

7. The transfer head according to claim 6, wherein:

a fourth cross section of the first groove is perpendicular to the first direction;

the fourth cross section is a rectangle; and

the fourth cross section along the second direction has a width substantially same as the long side of the trapezoid of the third cross section of the second groove.

8. The transfer head according to claim 5, wherein:

a third cross section of the second groove perpendicular to the first direction is a rectangle; and

protrusions are respectively formed on two opposite inner sidewalls of the second groove along the second direction; and

the third distance of the second groove is a distance between the protrusions of the second groove.

9. The transfer head according to claim 8, wherein:

the third distance between the protrusions on the two opposite inner sidewalls of the second groove is adjustable.

10. A transfer head according to claim 1, wherein:

a minimum distance between two opposite inner sidewalls of the second groove along a second direction perpendicular to the first direction is a third distance of the second groove;

the inorganic light-emitting diode has a multi-layer stacking structure;

a third direction is perpendicular to a stacking direction of the multi-layer stacking structure;

a minimum distance between two opposite outer sidewalls of the inorganic light-emitting diode along the third direction is a fourth distance; and

the third distance of the second groove is larger than the fourth distance of the inorganic light-emitting diode.

11. The transfer head according to claim 1, wherein:

a first through hole is formed in a bottom of the first groove adjacent to the second groove;

the transfer head further includes a first fixing block; and

the first fixing block is configured to enter the first groove via the first through hole and is movable along a depth direction of the first groove.

12. The transfer head according to claim 1, wherein:

a second through hole is formed in a bottom of the second groove;

the transfer head further includes a second fixing block; and

the second fixing block is configured to enter the second groove via the second through hole and is movable along a depth direction of the second groove.

13. A transfer head array comprising a plurality of transfer heads arranged in an array, wherein each of the plurality of transfer heads includes the transfer head according to claim 1.