Transfer head for transferring micro element and transferring method of micro element
First Claim
1. A transfer head for transferring micro elements, comprising:
- a cavity;
a plurality of vacuum paths connected with the cavity respectively and including valves for opening or closing;
a plurality of suction nozzles connected with the vacuum paths configured to hold or release the micro elements via vacuum pressure transmitted by each vacuum path; and
a switching component for controlling the valves to open or close the vacuum paths, so as to control the suction nozzles to hold or release required micro elements via vacuum pressure;
wherein the switching component comprises a CMOS memory circuit and an address electrode array connected to the CMOS memory circuit, wherein, each vacuum path valve corresponds to an address electrode in the array.
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Accused Products
Abstract
A transfer head for transferring micro element includes a cavity; a plurality of vacuum paths connected with the cavity respectively with valves configured at the connection between the cavity and the vacuum paths and used for opening/closing; a plurality of suction nozzles connected with the vacuum paths, wherein the suction nozzles hold or release the micro element via vacuum pressure; vacuum pressure is transmitted by each vacuum path; a switching component for controlling valve to open/close each vacuum path, so as to control the suction nozzles to hold or release required micro element via vacuum pressure. Further, the switching component includes a CMOS memory circuit and an address electrode array connected to the CMOS memory circuit to realize micro-switch array. The transfer head can selectively transfer a plurality of micro elements at one time.
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Citations
19 Claims
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1. A transfer head for transferring micro elements, comprising:
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a cavity; a plurality of vacuum paths connected with the cavity respectively and including valves for opening or closing; a plurality of suction nozzles connected with the vacuum paths configured to hold or release the micro elements via vacuum pressure transmitted by each vacuum path; and a switching component for controlling the valves to open or close the vacuum paths, so as to control the suction nozzles to hold or release required micro elements via vacuum pressure; wherein the switching component comprises a CMOS memory circuit and an address electrode array connected to the CMOS memory circuit, wherein, each vacuum path valve corresponds to an address electrode in the array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A transfer method for transferring micro elements, the method comprising:
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(1) placing at least one micro element over a first substrate; (2) using a transfer head of to orient and contact the micro element, wherein; the transfer head comprises; a cavity; a plurality of vacuum paths connected with the cavity respectively and including valves for opening or closing; a plurality of suction nozzles connected with the vacuum paths configured to hold or release the micro elements via vacuum pressure transmitted by each vacuum path; and a switching component for controlling the valves to open or close the vacuum paths, so as to control the suction nozzles to hold or release required micro elements via vacuum pressure; the suction nozzle holds the micro element via vacuum pressure, and controls each vacuum path valve via the switching component for controlling the opening or closing of the vacuum path so as to extract required micro element; and (3) orienting the transfer head with extracted micro element towards the second substrate, wherein, the suction nozzle releases the micro element via vacuum pressure, and controls each vacuum path valve via the switching component for controlling the opening or closing of the vacuum path so as to release the extracted micro element over the second substrate. - View Dependent Claims (17, 18, 19)
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Specification