Method of forming a semiconductor device
First Claim
1. A method of forming a semiconductor device, the method comprising:
- forming a semiconductor layer on a first surface of a semiconductor substrate, wherein impurities are introduced into a first sub-layer adjoining the semiconductor substrate at the first surface of the semiconductor substrate, the impurities being configured to absorb electromagnetic radiation of an energy smaller than a bandgap energy of the semiconductor substrate;
irradiating the semiconductor substrate with electromagnetic radiation, the electromagnetic radiation being absorbed by the impurities thereby generating a local damage of a crystal lattice of the semiconductor substrate; and
subsequent to and independent from irradiating the semiconductor substrate with the electromagnetic radiation, applying thermal processing to the semiconductor substrate and the semiconductor layer, including at the local damage, to regulate a temperature thereof, wherein the thermal processing is configured to cause a crack formation along the local damage of the crystal lattice by thermo-mechanical stress; and
separating the semiconductor layer and the semiconductor substrate by the thermal processing of the semiconductor substrate and the semiconductor layer.
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Accused Products
Abstract
Methods of forming a semiconductor device are provided. A method includes introducing impurities into a part of a semiconductor substrate at a first surface of the semiconductor substrate by ion implantation, the impurities being configured to absorb electromagnetic radiation of an energy smaller than a bandgap energy of the semiconductor substrate. The method further includes forming a semiconductor layer on the first surface of the semiconductor substrate. The method further includes irradiating the semiconductor substrate with electromagnetic radiation configured to be absorbed by the impurities and configured to generate local damage of a crystal lattice of the semiconductor substrate. The method further includes separating the semiconductor layer and the semiconductor substrate by thermal processing of the semiconductor substrate and the semiconductor layer, where the thermal processing is configured to cause crack formation along the local damage of the crystal lattice by thermo-mechanical stress.
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Citations
30 Claims
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1. A method of forming a semiconductor device, the method comprising:
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forming a semiconductor layer on a first surface of a semiconductor substrate, wherein impurities are introduced into a first sub-layer adjoining the semiconductor substrate at the first surface of the semiconductor substrate, the impurities being configured to absorb electromagnetic radiation of an energy smaller than a bandgap energy of the semiconductor substrate; irradiating the semiconductor substrate with electromagnetic radiation, the electromagnetic radiation being absorbed by the impurities thereby generating a local damage of a crystal lattice of the semiconductor substrate; and subsequent to and independent from irradiating the semiconductor substrate with the electromagnetic radiation, applying thermal processing to the semiconductor substrate and the semiconductor layer, including at the local damage, to regulate a temperature thereof, wherein the thermal processing is configured to cause a crack formation along the local damage of the crystal lattice by thermo-mechanical stress; and separating the semiconductor layer and the semiconductor substrate by the thermal processing of the semiconductor substrate and the semiconductor layer. - View Dependent Claims (21, 25, 26, 27)
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2. A method of forming a semiconductor device, the method comprising:
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introducing impurities into a part of a semiconductor substrate at a first surface of the semiconductor substrate by ion implantation, the impurities being configured to absorb electromagnetic radiation of an energy smaller than a bandgap energy of the semiconductor substrate; forming a semiconductor layer on the first surface of the semiconductor substrate; irradiating the semiconductor substrate with electromagnetic radiation, the electromagnetic radiation being absorbed by the impurities thereby generating a local damage of a crystal lattice of the semiconductor substrate; and subsequent to and independent from irradiating the semiconductor substrate with the electromagnetic radiation, applying thermal processing to the semiconductor substrate and the semiconductor layer, including at the local damage, to regulate a temperature thereof, wherein the thermal processing is configured to cause a crack formation along the local damage of the crystal lattice by thermo-mechanical stress; and separating the semiconductor layer and the semiconductor substrate by the thermal processing of the semiconductor substrate and the semiconductor layer. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 22, 23, 24, 28, 29, 30)
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Specification