Methods of forming a transistor and methods of forming an array of memory cells
First Claim
1. A method of forming a transistor, comprising:
- forming a gate construction having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outer surface of semiconductor material that is aside and above both sides of the gate construction;
covering tops of the semiconductor material and the conductive gate material with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material being laterally exposed above both of the sides of the gate construction; and
after the covering, monolayer doping the semiconductor material that is above both of the sides of the gate construction through each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs and forming there-from doped source/drain regions above both of the sides of the gate construction.
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Accused Products
Abstract
An embodiment of the invention comprises a method of forming a transistor comprising forming a gate construction having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outer surface of semiconductor material that is aside and above both sides of the gate construction. Tops of the semiconductor material and the conductive gate material are covered with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material are laterally exposed above both of the sides of the gate construction. After the covering, the semiconductor material that is above both of the sides of the gate construction is subjected to monolayer doping through each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs and forming there-from doped source/drain regions above both of the sides of the gate construction.
52 Citations
21 Claims
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1. A method of forming a transistor, comprising:
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forming a gate construction having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outer surface of semiconductor material that is aside and above both sides of the gate construction; covering tops of the semiconductor material and the conductive gate material with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material being laterally exposed above both of the sides of the gate construction; and after the covering, monolayer doping the semiconductor material that is above both of the sides of the gate construction through each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs and forming there-from doped source/drain regions above both of the sides of the gate construction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming a transistor, comprising:
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forming a gate construction having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outermost surface of semiconductor material that is aside and above both sides of the gate construction; and monolayer doping the semiconductor material that is above both of the sides of the gate construction and forming there-from doped source/drain regions above both of the sides of the gate construction, the monolayer doping being conducted in a vertically-self-aligned manner through two pairs of opposing sidewall surfaces of the semiconductor material that is above both of the sides of the gate construction.
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15. A method of forming a transistor, comprising:
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forming a gate construction having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outer surface of semiconductor material that is aside and above both sides of the gate construction; covering tops of the semiconductor material and the conductive gate material with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material being laterally exposed above both of the sides of the gate construction; forming a dopant monolayer directly on each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs; forming a covering material directly on the dopant monolayers; and diffusing dopants from the dopant monolayers having the covering material thereon into the semiconductor material that is above both of the sides of the gate construction through each of the two opposing sidewall surfaces of each of the two pairs and forming there-from doped source/drain regions above both of the sides of the gate construction. - View Dependent Claims (16, 17)
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18. A method of forming an array of memory cells, comprising:
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forming recessed-access-gate-line constructions within semiconductor material, the recessed-access-gate-line constructions individually having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outermost surface of the semiconductor material that is aside and above both sides of the individual recessed-access-gate-line construction, laterally-spaced pairs of the recessed-access-gate-line constructions individually comprising a digit-line-contact region laterally-inward between the recessed-access-gate-line constructions of the pair of the recessed-access-gate-line constructions and a capacitor-contact region laterally-outward of each of the recessed-access-gate-line constructions of the pair of the recessed-access-gate-line constructions; covering tops of the semiconductor material and the conductive gate material with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material being laterally exposed above both of the sides of the individual recessed-access-gate-line constructions; after the covering, monolayer doping the semiconductor material that is above both of the sides of the individual recessed-access-gate-line constructions through each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs and forming there-from doped source/drain regions above both of the sides of the individual recessed-access-gate-line constructions, the source/drain region laterally-inward between the recessed-access-gate-line constructions of individual of the pairs of the recessed-access-gate-line constructions comprising individual of the digit-line-contact regions, the source/drain regions laterally-outward of each of the recessed-access-gate-line constructions of the individual pairs of the recessed-access-gate-line constructions comprising individual of the capacitor-contact regions; and after the monolayer doping, forming capacitors individually electrically coupled to the individual capacitor-contact regions and forming digit lines individually electrically coupled to the individual digit-line-contact regions. - View Dependent Claims (19, 20)
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21. A method of forming an array of memory cells, comprising:
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forming recessed-access-gate-line constructions within semiconductor material, the recessed-access-gate-line constructions individually having an elevationally-outermost surface of conductive gate material that is lower than an elevationally-outermost surface of the semiconductor material that is aside and above both sides of the individual recessed-access-gate-line construction, laterally-spaced pairs of the recessed-access-gate-line constructions individually comprising a digit-line-contact region laterally-inward between the recessed-access-gate-line constructions of the pair of the recessed-access-gate-line constructions and a capacitor-contact region laterally-outward of each of the recessed-access-gate-line constructions of the pair of the recessed-access-gate-line constructions; covering tops of the semiconductor material and the conductive gate material with masking material, two pairs of two opposing sidewall surfaces of the semiconductor material being laterally exposed above both of the sides of the individual recessed-access-gate-line constructions; forming a dopant monolayer directly on each of the laterally-exposed two opposing sidewall surfaces of each of the two pairs above both of the sides of the individual recessed-access-gate-line constructions; forming a covering material directly on the dopant monolayers; diffusing dopants from the dopant monolayers having the covering material thereon into the semiconductor material that is above both of the sides of the individual recessed-access-gate-line constructions through each of the two opposing sidewall surfaces of each of the two pairs for the individual recessed-access-gate-line constructions and forming there-from doped source/drain regions above both of the sides of the individual recessed-access-gate-line constructions, the source/drain region laterally-inward between the recessed-access-gate-line constructions of individual of the pairs of the recessed-access-gate-line constructions comprising individual of the digit-line-contact regions, the source/drain regions laterally-outward of each of the recessed-access-gate-line constructions of the individual pairs of the recessed-access-gate-line constructions comprising individual of the capacitor-contact regions; and after the diffusing, forming capacitors individually electrically coupled to the individual capacitor-contact regions and forming digit lines individually electrically coupled to the individual digit-line-contact regions.
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Specification