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Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and method

  • US 10,643,912 B2
  • Filed: 07/24/2017
  • Issued: 05/05/2020
  • Est. Priority Date: 07/24/2017
  • Status: Active Grant
First Claim
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1. A monitoring structure for the testing of an integrated circuit (IC) with a set of metal levels, the monitoring structure comprising:

  • a set of serpentine-comb structures configured to connect with the IC at a back-end-of-line (BEOL), wherein each of the serpentine-comb structures is disposed on a corresponding side of the set of metal levels in the IC, each of the serpentine-comb structures including;

    a set of wires aligned with and parallel to the set of metal levels in the IC, each wire aligning with the corresponding one of the metal levels; and

    a set of vias, wherein sub-sets of two distinct vias in the set of vias connect two successive parallel wires aligned with two metal levels of the IC, wherein the set of vias and the set of wires form a chain of interconnected wires,wherein each sub-set of two distinct vias between two successive wires is located proximate to a same end of the two successive wires of the chain of interconnected wires,wherein the chain of interconnected wires is configured to detect a chip package interface (CPI) failure in the IC.

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