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Formation of fine pitch traces using ultra-thin PAA modified fully additive process

  • US 10,643,942 B2
  • Filed: 09/19/2019
  • Issued: 05/05/2020
  • Est. Priority Date: 02/02/2018
  • Status: Active Grant
First Claim
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1. A method of manufacturing a flexible substrate comprising:

  • providing a flexible dielectric substrate;

    applying an alkaline modification to said dielectric substrate to form a polyamic acid (PAA) anchoring layer on a surface of said dielectric substrate;

    electrolessly plating a Ni—

    P seed layer on said PAA layer;

    forming a photoresist pattern on said Ni—

    P seed layer;

    plating copper traces within said photoresist pattern;

    plating a surface finishing layer on said copper traces; and

    removing said photoresist pattern and etching away said Ni—

    P seed layer not covered by said copper traces to complete said flexible substrate.

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