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Conformal dummy die

  • US 10,643,957 B2
  • Filed: 08/27/2018
  • Issued: 05/05/2020
  • Est. Priority Date: 08/27/2018
  • Status: Active Grant
First Claim
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1. A packaged semiconductor device comprising:

  • a semiconductor die having a plurality of pads on an active side;

    a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads;

    a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die;

    an under bump metallization (UBM) layer formed on the plurality of pads, wherein top surfaces of the UBM layer on the plurality of pads provide the plurality of bondable surfaces;

    a plurality of solder bumps attached to the UBM layer on the plurality of pads, anda fillet of the silicone-based glue laterally surrounding and contacting each solder bump, wherein the fillet provides a sealed barrier over the active surface of the semiconductor die within each opening of the dummy die.

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