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Method for interconnecting stacked semiconductor devices

  • US 10,643,975 B2
  • Filed: 01/03/2018
  • Issued: 05/05/2020
  • Est. Priority Date: 09/27/2013
  • Status: Active Grant
First Claim
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1. A semiconductor assembly comprising:

  • a first die assembly including;

    a first die, anda first rim molded around the first die, the first rim extends laterally from the first die, wherein the first rim includes a first upper rim face and a first lower rim face;

    a second die assembly bonded with the first die assembly, the second die assembly includes;

    a second die,a second rim molded around the second die, the second rim extends laterally from the second die, wherein the second rim includes a second upper rim face and a second lower rim face, anda plurality of conductive traces extending from the second die laterally along one or more of the second upper or second lower rim faces;

    wherein the second lower rim face of the second die assembly is bonded to the first upper rim face of the first die assembly with the plurality of conductive traces therebetween; and

    one or more conductive vias extending through at least one of the first or second rims, the one or more conductive vias electrically coupled with one or more conductive traces of the plurality of conductive traces.

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