Method for interconnecting stacked semiconductor devices
First Claim
Patent Images
1. A semiconductor assembly comprising:
- a first die assembly including;
a first die, anda first rim molded around the first die, the first rim extends laterally from the first die, wherein the first rim includes a first upper rim face and a first lower rim face;
a second die assembly bonded with the first die assembly, the second die assembly includes;
a second die,a second rim molded around the second die, the second rim extends laterally from the second die, wherein the second rim includes a second upper rim face and a second lower rim face, anda plurality of conductive traces extending from the second die laterally along one or more of the second upper or second lower rim faces;
wherein the second lower rim face of the second die assembly is bonded to the first upper rim face of the first die assembly with the plurality of conductive traces therebetween; and
one or more conductive vias extending through at least one of the first or second rims, the one or more conductive vias electrically coupled with one or more conductive traces of the plurality of conductive traces.
0 Assignments
0 Petitions
Accused Products
Abstract
A method for making a semiconductor device includes forming rims on first and second dice. The rims extend laterally away from the first and second dice. The second die is stacked over the first die, and one or more vias are drilled through the rims after stacking. The semiconductor device includes redistribution layers extending over at least one of the respective first and second dice and the corresponding rims. The one or more vias extend through the corresponding rims, and the one or more vias are in communication with the first and second dice through the rims.
20 Citations
22 Claims
-
1. A semiconductor assembly comprising:
-
a first die assembly including; a first die, and a first rim molded around the first die, the first rim extends laterally from the first die, wherein the first rim includes a first upper rim face and a first lower rim face; a second die assembly bonded with the first die assembly, the second die assembly includes; a second die, a second rim molded around the second die, the second rim extends laterally from the second die, wherein the second rim includes a second upper rim face and a second lower rim face, and a plurality of conductive traces extending from the second die laterally along one or more of the second upper or second lower rim faces; wherein the second lower rim face of the second die assembly is bonded to the first upper rim face of the first die assembly with the plurality of conductive traces therebetween; and one or more conductive vias extending through at least one of the first or second rims, the one or more conductive vias electrically coupled with one or more conductive traces of the plurality of conductive traces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method for making a semiconductor assembly comprising:
-
forming a first die assembly including; molding a first rim on a first die, the first rim extends laterally from the first die; forming a second die assembly including; molding a second rim on a second die, the second rim extends laterally from the second die, and coupling a plurality of conductive traces along one or more of a second upper rim face or a second lower rim face of the second rim, the plurality of conductive traces extend laterally from the second die; bonding the second lower rim face of the second die assembly with a first upper rim face of the first die assembly with the plurality of conductive traces therebetween; and forming one or more conductive vias extending through at least one of the first or second rims, the one or more conductive vias in electrical communication with one or more conductive traces of the plurality of conductive traces. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
-
Specification