Emissive display substrate for surface mount micro-LED fluidic assembly
First Claim
1. An emissive display substrate comprising:
- a support substrate with a planar top surface and a light emitting diode (LED) cross-point control matrix comprising an array of column and row conductive lines;
a first thin-film layer overlying the support substrate top surface, comprising a plurality of wells; and
,wherein each well has a convex bottom electrical interface surface, including a first substrate electrode connected to a corresponding column line and a second substrate electrode connected to a corresponding row line, and where the first substrate electrode is not co-planar with the second substrate electrode.
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Abstract
Planar surface mount (SM) micro light emitting diodes (μLEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
10 Citations
23 Claims
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1. An emissive display substrate comprising:
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a support substrate with a planar top surface and a light emitting diode (LED) cross-point control matrix comprising an array of column and row conductive lines; a first thin-film layer overlying the support substrate top surface, comprising a plurality of wells; and
,wherein each well has a convex bottom electrical interface surface, including a first substrate electrode connected to a corresponding column line and a second substrate electrode connected to a corresponding row line, and where the first substrate electrode is not co-planar with the second substrate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for fabricating an emissive display substrate, the method comprising:
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providing a support substrate with a planar top surface and a light emitting diode (LED) cross-point control matrix comprising an array of column and row conductive lines; forming an array of convex well bottom electrical interfaces overlying the support substrate top surface, where each convex well bottom electrical interface includes a first substrate electrode and a second substrate electrode, and where the second substrate electrode is non co-planar with the first substrate electrode; forming a first thin-film layer overlying the support substrate top surface and convex well bottom electrical interfaces; and
,forming wells in the first thin-film layer, exposing the convex well bottom electrical interfaces. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. An emissive display substrate comprising:
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a support substrate with a planar top surface and a light emitting diode (LED) cross-point control matrix comprising an array of column and row conductive lines; a first thin-film layer overlying the support substrate top surface, comprising a plurality of wells; and
,wherein each well has a bottom electrical interface, including a center first substrate electrode connected to a corresponding column line and a perimeter second substrate electrode connected to a corresponding row line, and where the distance of the perimeter second substrate electrode from the substrate top surface is less than the distance of the center first electrode from the support substrate top surface.
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Specification