Semiconductor device having voltage regulators embedded in layered package
First Claim
1. A semiconductor device, comprising:
- a package including circuitry arranged in layers that are electrically connected to one another through electrically conductive vias;
a semiconductor die positioned on a front side of the package and electrically connected to the package;
an electrical connection positioned on the package and electrically connected to the package; and
a voltage regulator embedded within the package, the voltage regulator configured to accept a first voltage from the electrical connection, reduce the first voltage to a second voltage, and deliver the second voltage to the semiconductor die.
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Accused Products
Abstract
A computing chip can include one or more voltage regulators to decrease a standard voltage, such as twelve volts, to a relatively low operating voltage of its processing cores, typically around one volt. Because the power consumed by the cores can be substantial, such as three hundred watts or more, it is desirable to locate the voltage regulators as close as possible to the cores, to reduce the distances that relatively large currents have to travel in the chip circuitry. The voltage regulators can be embedded within the package, such as in a layered structure, in a layer that electrically connects to the cores. While the cores are typically manufactured using the smallest possible lithographic features, the voltage regulators are less demanding and can instead use relatively large lithographic features, which can be formed using relatively old technology, and can therefore be relatively inexpensive.
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Citations
20 Claims
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1. A semiconductor device, comprising:
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a package including circuitry arranged in layers that are electrically connected to one another through electrically conductive vias; a semiconductor die positioned on a front side of the package and electrically connected to the package; an electrical connection positioned on the package and electrically connected to the package; and a voltage regulator embedded within the package, the voltage regulator configured to accept a first voltage from the electrical connection, reduce the first voltage to a second voltage, and deliver the second voltage to the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for manufacturing a semiconductor device, comprising:
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attaching a computing element to a front side of a package, the computing element electrically connecting to the package; forming an electrical connection on a back side of the package, the electrical connection electrically connecting to the package; and embedding a voltage regulator within the package, the voltage regulator configured to accept a first voltage from the electrical connection, reduce the first voltage to a second voltage, and deliver the second voltage to the computing element. - View Dependent Claims (15, 16)
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17. A semiconductor device, comprising:
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a package including circuitry arranged in layers that are electrically connected to one another through electrically conductive vias; a plurality of semiconductor dies positioned on a front side of the package and electrically connected to the package; a plurality of electrical connections positioned on a back side of the package and electrically connected to the package; and a plurality of voltage regulators embedded within the package, each voltage regulator of the plurality of voltage regulators configured to accept a first voltage from an electrical connection, reduce the first voltage to a second voltage, and deliver the second voltage to a respective semiconductor die of the plurality of semiconductor dies. - View Dependent Claims (18, 19, 20)
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Specification