Semiconductor device and manufacturing method therefor
First Claim
1. A semiconductor device comprising:
- a first projecting unit which is a part of a semiconductor substrate, projects from an upper surface of the semiconductor substrate, and extends in a first direction along a main surface of the semiconductor substrate;
a first gate electrode which is formed over an upper surface and a side surface of the first projecting unit through a first gate insulating film, and extends in a second direction orthogonal to the first direction;
a second gate electrode which is formed over the upper surface and the side surface of the first projecting unit through a second gate insulating film, is adjacent to a first side surface of the first gate electrode through the second gate insulating film, and extends in the second direction;
a sidewall spacer which is formed beside a second side surface of the first gate electrode on a side opposed to the first side surface;
a semiconductor region which is formed in the first projecting unit beside the sidewall spacer;
a first insulating film which is formed over the semiconductor region;
a first interlayer insulating film which is formed over the first insulating film;
a second interlayer insulating film which is formed over the first interlayer insulating film and the first gate electrode; and
a plug which is formed in the second interlayer insulating film, the first interlayer insulating film, and the first insulating film, in a manner to reach the semiconductor region,wherein a cap film is formed between the first gate electrode and the second interlayer insulating film,wherein the plug is positioned also right over the cap film, andwherein the first interlayer insulating film and the second interlayer insulating film are formed from a material which differs from that of the first insulating film and the cap film.
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Accused Products
Abstract
On the upper surface of a fin projecting from the upper surface of a semiconductor substrate, there are formed a control gate electrode through a gate insulating film and a memory gate electrode through a gate insulating film. A semiconductor region is formed in the fin beside the control gate electrode. On the semiconductor region, an insulating film, a first interlayer insulating film, and a second interlayer insulating film are formed. A plug reaching the semiconductor region is formed in the second interlayer insulating film, the first interlayer insulating film, and the insulating film. A cap film is formed between the control gate electrode and the interlayer insulating film, and the plug is positioned also right above the cap film.
12 Citations
18 Claims
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1. A semiconductor device comprising:
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a first projecting unit which is a part of a semiconductor substrate, projects from an upper surface of the semiconductor substrate, and extends in a first direction along a main surface of the semiconductor substrate; a first gate electrode which is formed over an upper surface and a side surface of the first projecting unit through a first gate insulating film, and extends in a second direction orthogonal to the first direction; a second gate electrode which is formed over the upper surface and the side surface of the first projecting unit through a second gate insulating film, is adjacent to a first side surface of the first gate electrode through the second gate insulating film, and extends in the second direction; a sidewall spacer which is formed beside a second side surface of the first gate electrode on a side opposed to the first side surface; a semiconductor region which is formed in the first projecting unit beside the sidewall spacer; a first insulating film which is formed over the semiconductor region; a first interlayer insulating film which is formed over the first insulating film; a second interlayer insulating film which is formed over the first interlayer insulating film and the first gate electrode; and a plug which is formed in the second interlayer insulating film, the first interlayer insulating film, and the first insulating film, in a manner to reach the semiconductor region, wherein a cap film is formed between the first gate electrode and the second interlayer insulating film, wherein the plug is positioned also right over the cap film, and wherein the first interlayer insulating film and the second interlayer insulating film are formed from a material which differs from that of the first insulating film and the cap film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A manufacturing method for a semiconductor device, comprising the steps of:
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(a) preparing a semiconductor substrate; (b) retreating a part of the semiconductor substrate, thereby forming a first projecting unit, which is apart of the semiconductor substrate, projects from an upper surface of the semiconductor substrate, and extends in a first direction along a main surface of the semiconductor substrate; (c) forming a dummy gate electrode over the upper surface and a side surface of the first projecting unit through a first insulating film; (d) forming a second gate insulating film over the upper surface and the side surface of the first projecting unit and over a first side surface of the dummy gate electrode; (e) forming a second gate electrode over the upper surface and the side surface of the first projecting unit and over a second side surface of the dummy gate electrode on a side opposed to the first side surface, through the second gate insulating film; (f) forming a sidewall spacer over the upper surface of the first projecting unit and over the second side surface of the dummy gate electrode, after the step (e); (g) forming a semiconductor region in the first projecting unit beside the sidewall spacer, using ion implantation; (h) forming a second insulating film over the semiconductor region; (i) forming a first interlayer insulating film over the second insulating film; (j) forming an opening for exposing the first projecting unit between the sidewall spacer and the second gate insulating film, by removing the dummy gate electrode and the first insulating film, after the step (i); (k) forming a first gate insulating film in the opening; (l) embedding a first gate electrode in the opening, through the first gate insulating film; (m) retreating an upper surface of the first gate electrode; (n) forming a cap film over the first gate electrode in a manner to fill the opening, after the step (m); (o) forming a second interlayer insulating film over the first interlayer insulating film and the cap film, after the step (n); and (p) forming a contact hole reaching the semiconductor region, in the second interlayer insulating film, the first interlayer insulating film, and the second insulating film, wherein the contact hole is positioned right above the cap film, and wherein the first interlayer insulating film and the second interlayer insulating film are formed from a material which differs from that of the second insulating film and the cap film. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification