Fan-out sensor package and optical fingerprint sensor module including the same
First Claim
1. A fan-out sensor package comprising:
- a connection member having a through-hole;
an image sensor disposed in the through-hole and having an active surface having connection pads and a sensor region disposed thereon and an inactive surface opposing the active surface;
an optical lens disposed on the active surface of the image sensor, the optical lens including a lower surface facing the active surface of the image sensor and an upper surface opposing the lower surface;
an encapsulant encapsulating at least portions of the connection member, the image sensor, and the optical lens;
an insulating member covering the connection member, the active surface, and the upper surface of the optical lens; and
a redistribution layer disposed on the insulating member,wherein the connection member includes a first wiring layer,the redistribution layer electrically connects the first wiring layer and the connection pads to each other, andthe active surface of the image sensor is spaced apart from the insulating member.
2 Assignments
0 Petitions
Accused Products
Abstract
There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.
24 Citations
12 Claims
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1. A fan-out sensor package comprising:
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a connection member having a through-hole; an image sensor disposed in the through-hole and having an active surface having connection pads and a sensor region disposed thereon and an inactive surface opposing the active surface; an optical lens disposed on the active surface of the image sensor, the optical lens including a lower surface facing the active surface of the image sensor and an upper surface opposing the lower surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and the optical lens; an insulating member covering the connection member, the active surface, and the upper surface of the optical lens; and a redistribution layer disposed on the insulating member, wherein the connection member includes a first wiring layer, the redistribution layer electrically connects the first wiring layer and the connection pads to each other, and the active surface of the image sensor is spaced apart from the insulating member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A fan-out sensor package comprising:
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a connection member having a through-hole; an image sensor disposed in the through-hole and having an active surface having connection pads and a sensor region disposed thereon and an inactive surface opposing the active surface; an optical lens disposed on the active surface of the image sensor; an encapsulant encapsulating at least portions of the connection member, the image sensor, and the optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens, wherein the connection member includes a first wiring layer, the redistribution layer electrically connects the first wiring layer and the connection pads to each other, the connection member includes an insulating layer, the first wiring layer disposed on one surface of the insulating layer, a second wiring layer disposed on the other surface of the insulating layer, and vias penetrating through the insulating layer and electrically connecting the first and second wiring layers to each other, the first and second wiring layers are electrically connected to the connection pads, and the fan-out sensor package, further comprises; a backside redistribution layer disposed on the encapsulant; backside vias penetrating through at least portions of the encapsulant and electrically connecting the second wiring layer and the backside redistribution layer to each other; and a passivation layer disposed on the encapsulant and having openings exposing at least portions of the backside redistribution layer. - View Dependent Claims (11)
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12. A fan-out sensor package comprising:
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a connection member having a through-hole; an image sensor disposed in the through-hole and having an active surface having connection pads and a sensor region disposed thereon and an inactive surface opposing the active surface; an optical lens disposed on the active surface of the image sensor; an encapsulant encapsulating at least portions of the connection member, the image sensor, and the optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens, wherein the connection member includes a first wiring layer, the redistribution layer electrically connects the first wiring layer and the connection pads to each other, the encapsulant covers the inactive surface and side surfaces of the image sensor, covers at least portions of the active surface of the image sensor, and is in direct contact with a side surface of the optical lens, the optical lens includes a lower surface facing the active surface of the image sensor and an upper surface opposing the lower surface, and an upper surface of the first wiring layer, an upper surface of the encapsulant, and the upper surface of the optical lens are coplanar with each other.
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Specification