Dual-gate PMOS field effect transistor with InGaAs channel
First Claim
1. A Field Effect Transistor (FET), comprising:
- a bottom gate structure comprising a bottom gate electrode and a bottom gate dielectric layer;
an InGaAs channel layer;
a top gate structure comprising a top gate electrode and a top gate dielectric layer different from the bottom gate electrode and bottom gate dielectric layer; and
a lower interface control layer and an upper interface control layer,wherein the bottom gate dielectric layer is disposed between the bottom gate electrode and the InGaAs channel layer, and the top gate dielectric layer is disposed between the top gate electrode and the InGaAs channel layer,wherein the lower interface control layer is disposed between the bottom gate dielectric layer and the InGaAs channel layer, and the upper interface control layer is disposed between the top gate structure and the InGaAs channel layer, andwherein the upper interface control layer and the lower interface control layer each have a bandgap greater than that of the InGaAs channel layer, and the upper interface control layer and the lower interface control layer each has a first type of quantum well band alignment relationship with the InGaAs channel layer, andwherein the upper interface control layer and the lower interface control layer each have a thickness in a range between a single atomic layer and 20 nm.
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Accused Products
Abstract
The present disclosure relates to the field of semiconductor Integrated Circuit (IC) manufacture, and provides an InGaAs-based double-gate PMOS Field Effect Transistor (FET). The FET includes a bottom gate electrode, a bottom gate dielectric layer, a bottom gate interface control layer, an InGaAs channel layer, an upper interface control layer, a highly doped P-type GaAs layer, an ohmic contact layer, source/drain metal electrodes, a top gate dielectric layer and a top gate electrode. The source/drain metal electrodes are located on opposite sides of the ohmic contact layer. A gate trench structure is etched to an upper surface of the interface control layer between the source and drain metal electrodes. The top gate dielectric layer uniformly covers an inner surface of the gate trench structure, and the top gate electrode is provided on the top gate dielectric layer. The present disclosure provides a PMOS FET with better gate control functionality and a low interface density with the double-gate structure and interface control layer design, in order to meet the requirements of high-performance PMOS transistors.
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Citations
13 Claims
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1. A Field Effect Transistor (FET), comprising:
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a bottom gate structure comprising a bottom gate electrode and a bottom gate dielectric layer; an InGaAs channel layer; a top gate structure comprising a top gate electrode and a top gate dielectric layer different from the bottom gate electrode and bottom gate dielectric layer; and a lower interface control layer and an upper interface control layer, wherein the bottom gate dielectric layer is disposed between the bottom gate electrode and the InGaAs channel layer, and the top gate dielectric layer is disposed between the top gate electrode and the InGaAs channel layer, wherein the lower interface control layer is disposed between the bottom gate dielectric layer and the InGaAs channel layer, and the upper interface control layer is disposed between the top gate structure and the InGaAs channel layer, and wherein the upper interface control layer and the lower interface control layer each have a bandgap greater than that of the InGaAs channel layer, and the upper interface control layer and the lower interface control layer each has a first type of quantum well band alignment relationship with the InGaAs channel layer, and wherein the upper interface control layer and the lower interface control layer each have a thickness in a range between a single atomic layer and 20 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A Field Effect Transistor (FET), comprising:
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a bottom gate structure comprising a bottom gate electrode and a bottom gate dielectric layer; an InGaAs channel layer having a thickness of 1 to 20 nm, a top gate structure comprising a top gate electrode and top gate dielectric layer, wherein the top gate electrode and top gate dielectric layer are different from the bottom gate electrode and bottom gate dielectric layer; and a lower interface control layer and an upper interface control layer wherein the upper interface control layer and the lower interface control layer each have a thickness in a range between a single atomic layer and 20 nm and wherein the upper interface control layer and the lower interface control layer both have a lattice having a matching or pseudo-mating relationship with that of the InGaAs channel layer, wherein the bottom gate dielectric layer is disposed between the bottom gate electrode and the InGaAs channel layer, and the top gate dielectric layer is disposed between the top gate electrode and the InGaAs channel layer, wherein the lower interface control layer is disposed between the bottom gate dielectric layer and the InGaAs channel layer, and the upper interface control layer is disposed between the top gate dielectric layer and the InGaAs channel layer, and wherein the upper interface control layer and the lower interface control layer each have a bandgap greater than that of the InGaAs channel layer, and the upper interface control layer and the lower interface control layer each has a first type of quantum well band alignment relationship with the InGaAs channel layer.
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Specification