Systems, methods and devices for isolation for subfin leakage
First Claim
1. An apparatus comprising:
- a substrate layer comprising silicon;
a transition layer comprising silicon and germanium coupled to the substrate layer;
a germanium layer coupled to the transition layer;
a transistor gate coupled to the germanium layer; and
an implanted layer comprising an implant causing exposed portions of the germanium layer to become resistive, andwherein an area underneath the transistor gate remains without implant.
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Accused Products
Abstract
A subfin leakage problem with respect to the silicon-germanium (SiGe)/shallow trench isolation (STI) interface can be mitigated with a halo implant. A halo implant is used to form a highly resistive layer. For example, a silicon substrate layer 204 is coupled to a SiGe layer, which is coupled to a germanium (Ge) layer. A gate is disposed on the Ge layer. An implant is implanted in the Ge layer that causes the layer to become more resistive. However, an area does not receive the implant due to being protected (or covered) by the gate. The area remains less resistive than the remainder of the Ge layer. In some embodiments, the resistive area of a Ge layer can be etched and/or an undercuttage (etch undercut or EUC) can be performed to expose the unimplanted Ge area of the Ge layer.
6 Citations
19 Claims
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1. An apparatus comprising:
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a substrate layer comprising silicon; a transition layer comprising silicon and germanium coupled to the substrate layer; a germanium layer coupled to the transition layer; a transistor gate coupled to the germanium layer; and an implanted layer comprising an implant causing exposed portions of the germanium layer to become resistive, and wherein an area underneath the transistor gate remains without implant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for constructing an integrated circuit gate with reduced parasitic subfin leakage, the method comprising:
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providing a substrate comprising a silicon layer, a germanium layer and a transition layer comprising silicon and germanium coupled between the silicon layer and the germanium layer; exposing the germanium layer; disposing a gate on the germanium layer; and performing implantation to create a resistive area, wherein an area underneath the gate remains without implant. - View Dependent Claims (12, 13, 14, 15)
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16. A computing device comprising:
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a processor mounted on a substrate; a memory unit capable of storing data; a graphics processing unit; an antenna within the computing device; a display on the computing device; a battery within the computing device; a power amplifier within the processor; and a voltage regulator within the processor; wherein the processor comprises; a substrate layer comprising silicon; a transition layer comprising silicon and germanium coupled to the substrate layer; a germanium layer coupled to the transition layer; a transistor gate coupled to the germanium layer; and an implanted layer comprising an implant causing exposed portions of the germanium layer to become resistive, and wherein an area underneath the transistor gate remains without implant. - View Dependent Claims (17, 18, 19)
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Specification