Techniques for contact formation in self-aligned replacement gate device
First Claim
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1. A method, comprising:
- providing a device structure, the device structure comprising;
a semiconductor region, anda gate structure, disposed over the semiconductor region, the gate structure comprising a gate metal; and
oxidizing an upper portion of the gate metal, wherein the upper portion forms an oxide cap, and wherein a lower portion of the gate metal remains metallic,wherein the gate structure comprises a tungsten gate metal, a nitride sidewall spacer, disposed along the tungsten gate metal, and wherein the device structure further comprises a dielectric, disposed outside the nitride sidewall spacer, the method further comprising;
selectively etching a top region of the oxide cap, wherein a bottom region of the oxide cap remains above the lower portion of the gate metal after the selectively etching.
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Abstract
A method may include providing a device structure, where the device structure includes a semiconductor region, and a gate structure, disposed over the semiconductor region. The gate structure may further include a gate metal. The method may further include oxidizing an upper portion of the gate metal, wherein the upper portion forms an oxide cap, and wherein a lower portion of the gate metal remains metallic.
4 Citations
15 Claims
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1. A method, comprising:
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providing a device structure, the device structure comprising; a semiconductor region, and a gate structure, disposed over the semiconductor region, the gate structure comprising a gate metal; and oxidizing an upper portion of the gate metal, wherein the upper portion forms an oxide cap, and wherein a lower portion of the gate metal remains metallic, wherein the gate structure comprises a tungsten gate metal, a nitride sidewall spacer, disposed along the tungsten gate metal, and wherein the device structure further comprises a dielectric, disposed outside the nitride sidewall spacer, the method further comprising; selectively etching a top region of the oxide cap, wherein a bottom region of the oxide cap remains above the lower portion of the gate metal after the selectively etching. - View Dependent Claims (2, 3, 4, 5)
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6. A method, comprising:
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forming a device structure, the device structure comprising; a semiconductor fin; a gate structure, disposed over a first portion of the semiconductor fin, the gate structure comprising a gate metal and a set of sidewall spacers; and a source/drain structure, disposed over a second portion of the semiconductor fin; oxidizing an upper portion of the gate metal, wherein the upper portion forms an oxide cap, and wherein a lower portion of the gate metal remains metallic; and selectively removing a top region of the oxide cap, wherein a bottom region of the oxide cap remains above the lower portion of the gate metal. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A method, comprising:
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providing a device structure, the device structure comprising; a semiconductor fin, and a gate structure, disposed over the semiconductor fin, the gate structure comprising a tungsten gate metal and a set of sidewall spacers; oxidizing an upper portion of the tungsten gate metal, wherein the upper portion forms a tungsten oxide, and wherein a lower portion of the tungsten gate metal remains metallic; and selectively removing a top region of the tungsten oxide, wherein a bottom region of the tungsten oxide remains above the lower portion of the tungsten gate metal. - View Dependent Claims (14, 15)
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Specification