Counterbore pocket structure for fluidic assembly

• US 10,644,190 B2
• Filed: 01/01/2018
• Issued: 05/05/2020
• Est. Priority Date: 12/27/2011
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Zhan, Changqing, Schuele, Paul John, Crowder, Mark Albert, Garner, Sean Mathew, Kiczenski, Timothy James
• Primary Examiner(s): Diaz, Jose R
• Application Number:
  US15/859,671
• Publication Number:
  US 20180138355A1
• Time in Patent Office: 855 Days
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/0008 Processes
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/04 with a quantum effect structure or superlattice, e.g. tunnel junction
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/18 within the light emitting region
• CPC Class Codes: H01L 33/24 of the light emitting region, e.g. non-planar junction
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/42 : Transparent materials

Abstract

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

Claims

1. A fluidic assembly substrate comprising:

a substrate comprising a top surface and a bottom surface;

a plurality of pocket structures extending from the substrate top surface into the substrate, wherein at least one of the pocket structures has a keyhole shape with a first portion overlying a through-hole and having a first diameter, and a second portion overlapping the first portion, the second portion having a crescent moon-shape with a second diameter, and wherein the second diameter is greater than the first diameter; and

,

wherein the through-hole is formed between the at least one pocket structure and the substrate bottom surface.

2. The fluidic assembly substrate of claim 1, wherein the substrate comprises:

a first layer with through-holes formed between a first layer top surface and a first layer bottom surface; and

,

a second layer with pocket structure formed between a second layer top surface and a second layer bottom surface.

3. The fluidic assembly substrate of claim 1, wherein the substrate is transparent.

4. A substrate assembly comprising:

a substrate comprising a top surface and a bottom surface;

a plurality of pocket structures formed in the substrate top surface, wherein the pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate an object diameter, and a second portion overlapping the first portion, having a second diameter greater than the first diameter;

a through-hole formed between each pocket structure and the substrate bottom surface; and

,

an object at least sliding fit positioned inside each pocket structure, wherein the sliding fit position includes the object being positioned in the pocket structure and outside of the through-hole.

5. The substrate assembly of claim 4, wherein the through-hole is offset from the first diameter center, away from the second portion.

6. The substrate assembly of claim 4, wherein the substrate is transparent.

7. The substrate assembly of claim 4, wherein the objects are disks;

and,

wherein the pocket structures have a keyhole shape with a first portion overlying the through-hole, with a first diameter transition fit to accommodate a disk diameter, and a second portion overlapping the first portion, having a crescent moon-shape with a second diameter greater than the first diameter.

8. The substrate assembly of claim 4, wherein the substrate is transparent;

and,

wherein the objects are light emitting diodes (LEDs) in the form of disks.

9. A fluidic assembly apparatus, the substrate comprising:

a substrate including a top surface and a bottom surface;

at least one pocket structure extending from the substrate top surface into the substrate, wherein the pocket structure includes a first region having a first diameter and a second region having a second diameter, wherein the first diameter overlaps the second diameter, and wherein a portion of the first region extends beyond the second diameter; and

a through-hole extending from the first region of the pocket structure to the substrate bottom surface.

10. The apparatus of claim 9, wherein the through-hole has a third diameter, wherein the third diameter is less than both the first diameter and the second diameter.

11. The apparatus of claim 9, wherein the though-hole is off-center on the first diameter.

12. The apparatus of claim 9, wherein the through via is entirely beyond the second diameter.

13. The apparatus of claim 9, wherein the second region is larger than the first region.

14. The apparatus of claim 9, wherein the first radius is less than the second radius.

15. The apparatus of claim 9, wherein the through-hole is offset from a center of the first region and away from the second region.

16. The apparatus of claim 9, wherein the substrate is transparent.

17. The apparatus of claim 9, wherein the through-hole is centered on the first diameter.

18. A fluidic assembly method using a pocket structure, the method comprising:

providing a substrate comprising a top surface and a bottom surface, wherein the substrate includes a plurality of pocket structures extending from the substrate top surface into the substrate, wherein at least one of the pocket structures has a keyhole shape with a first portion overlying a through-hole and having a first diameter, and a second portion overlapping the first portion, the second portion having a crescent moon-shape with a second diameter, wherein the second diameter is greater than the first diameter, and wherein the through-hole is formed between the at least one pocket structure and the substrate bottom surface;

flowing a fluid carrying a plurality of objects over the substrate top surface;

creating a suction pressure at the substrate bottom surface; and

,

in response to the suction pressure from the through-holes, drawing the objects into the pocket structures.

19. The method of claim 18, wherein the substrate is transparent.

20. The method of claim 18, wherein the objects are light emitting diodes (LEDs) in the form of disks.

21. The method of claim 18, wherein flowing the fluid over the substrate top surface includes:

arranging the substrate top surface with a substrate first side higher than a substrate second side;

introducing the fluid carrying the plurality of objects to the substrate first side; and

,

wherein drawing objects into the pocket structures includes drawing the objects in response to gravity as well as suction pressure.

22. The method of claim 18, wherein flowing the fluid carrying the plurality of objects over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) over the substrate top surface.

23. A fluidic assembly method using a substrate including pocket structures, the method comprising:

providing a substrate comprising a top surface and a bottom surface, with a plurality of pocket structures extending from the substrate top surface into the substrate, with each pocket structure has a through-hole extending from the pocket structure to the substrate bottom surface, and wherein the pocket structures have a first diameter sliding fit to accommodate a disk diameter;

flowing a fluid carrying a plurality of disks over the substrate top surface;

creating a suction pressure at the substrate bottom surface; and

,

in response to the suction pressure from the through-holes, drawing the disks into the pocket structures.

24. The method of claim 23, wherein flowing the fluid over the substrate top surface includes:

arranging the substrate top surface with a substrate first side higher than a substrate second side;

introducing the fluid carrying the plurality of disks to the substrate first side; and

,

wherein drawing disks into the pocket structures includes drawing the disks in response to gravity as well as suction pressure.

25. The method of claim 23, wherein providing the substrate includes providing a transparent substrate;

and,

wherein flowing the fluid carrying the plurality of disks over the substrate top surface includes flowing a plurality of light emitting diodes (LEDs) in the shape of a disk over the substrate top surface.