Manufacturing method of light emitting diode device and light emitting diode device having light emitting units with each light emitting unit including second sub light emitting unit in tandem with first sub light emitting unit

• US 10,644,195 B2
• Filed: 11/15/2017
• Issued: 05/05/2020
• Est. Priority Date: 03/15/2017
• Status: Active Grant

• Current Assignee: Beijing BOE Optoelectronics Technology Co Ltd. (BOE Technology Group Co., Ltd.), BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Tian, Ting, Zhai, Ming, Dou, Shuqian, Zhou, Dayong, Cheng, Jun, Fu, Xiaoliang, Fan, Zhiqiang, Kang, Taesung
• Primary Examiner(s): Jung, Michael
• Application Number:
  US15/813,803
• Publication Number:
  US 20180269352A1
• Time in Patent Office: 902 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/28 containing only elements of Group II and Group VI of the Periodic Table
• CPC Class Codes: H01L 33/30 containing only elements of Group III and Group V of the Periodic Table
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/34 containing only elements of Group IV of the Periodic Table
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.

Claims

1. A light emitting diode (LED) device, comprising:

a light emitting unit, the light emitting unit comprising a first sub light emitting unit and a second sub light emitting unit spaced apart from each other;

wherein,

the first sub light emitting unit comprises a first semiconductor layer with a first conductive type, a first light emitting layer, and a second semiconductor layer with a second conductive type, which are sequentially disposed; and

the second sub light emitting unit comprises the first semiconductor layer, the first light emitting layer, the second semiconductor layer, a second light emitting layer, and a third semiconductor layer with the first conductive type, which are sequentially disposed,

wherein, in a region provided with the first sub light emitting unit, the second semiconductor layer is an outermost semiconductor layer, without being covered by any other semiconductor layers, in a direction from the first semiconductor layer to the second semiconductor layer,

wherein, in a region provided with the second sub light emitting unit, the third semiconductor layer is an outermost semiconductor layer, without being covered by any other semiconductor layers, in a direction from the first semiconductor layer to the third semiconductor layer, and

wherein in the second sub light emitting unit, the second semiconductor layer is between the first light emitting layer and the second light emitting layer and directly contacts each of the first light emitting layer and the second light emitting layer.

2. The light emitting diode device according to claim 1, wherein

in the first sub light emitting unit, the first light emitting layer and the second semiconductor layer partially cover the first semiconductor layer, a first electrode is disposed on an exposed portion of the first semiconductor layer, and a second electrode is disposed on the second semiconductor layer;

and

in the second sub light emitting unit, the second light emitting layer and the third semiconductor layer partially cover the second semiconductor layer, a fourth electrode is disposed on an exposed portion of the second semiconductor layer, and a third electrode is disposed on the third semiconductor layer.

3. The light emitting diode device according to claim 2, wherein

the light emitting unit further comprises a third sub light emitting unit spaced apart from the first sub light emitting unit and the second sub light emitting unit,

the third sub light emitting unit comprises the first semiconductor layer, the first light emitting layer, the second semiconductor layer, the second light emitting layer, the third semiconductor layer, a third light emitting layer, and a fourth semiconductor layer with the second conductive type, which are sequentially disposed,

wherein, in a region provided with the third sub light emitting unit, the fourth semiconductor layer is an outermost semiconductor layer in a direction from the first semiconductor layer to the fourth semiconductor layer.

4. The light emitting diode device according to claim 3, wherein

in the third sub light emitting unit, the third light emitting layer and the fourth semiconductor layer partially cover the third semiconductor layer, a fifth electrode is disposed on an exposed portion of the third semiconductor layer, and a sixth electrode is disposed on the fourth semiconductor layer.

5. The light emitting diode device according to claim 4, further comprising:

a substrate, the substrate comprising a plurality of contact electrodes insulated from each other, wherein the light emitting unit is bonded to the substrate in an arrangement wherein the second semiconductor layer is closer to the substrate than is the first semiconductor layer, and the light emitting unit is electrically connected with corresponding contact electrodes.

6. The light emitting diode device according to claim 3, wherein a wavelength of light emitted from the first light emitting layer is less than a wavelength of light emitted from the second light emitting layer and a wavelength of light emitted from the third light emitting layer, and the wavelength of the light emitted from the second light emitting layer is less than the wavelength of the light emitted from the third light emitting layer.

7. The light emitting diode device according to claim 2, further comprising:

a substrate, the substrate comprising a plurality of contact electrodes insulated from each other,

wherein the light emitting unit is bonded to the substrate in an arrangement wherein the second semiconductor layer is closer to the substrate than is the first semiconductor layer, and the light emitting unit is electrically connected with corresponding contact electrodes.

8. The light emitting diode device according to claim 2, wherein the first electrode is electrically disconnected with the fourth electrode, and the second electrode is electrically disconnected with the third electrode.

9. The light emitting diode device according to claim 1, wherein the first sub light emitting unit does not comprise a layer provided in a same layer as the second light emitting layer, and the first sub light emitting unit does not comprise a layer provided in a same layer as the third semiconductor layer with the first conductive type.

10. The light emitting diode device according to claim 1, wherein a color of light emitted by the first sub light emitting unit is different from a color of light emitted by the second sub light emitting unit.

11. A manufacturing method of a light emitting diode (LED) device, comprising:

forming a light emitting lamination layer on a base substrate, the light emitting lamination layer comprising a first semiconductor layer with a first conductive type, a first light emitting layer, a second semiconductor layer with a second conductive type, a second light emitting layer, and a third semiconductor layer with the first conductive type sequentially formed on the base substrate;

dividing the light emitting lamination layer to form a light emitting unit, the light emitting unit comprising a first area and a second area spaced from each other; and

completely removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit comprising the first semiconductor layer, the first light emitting layer, and the second semiconductor layer in the first area, and form a second sub light emitting unit comprising the first semiconductor layer, the first light emitting layer, the second semiconductor layer, the second light emitting layer, and the third semiconductor layer in the second area,

wherein, in a region provided with the first sub light emitting unit, the second semiconductor layer is an outermost semiconductor layer, without being covered by any other semiconductor layers, in a direction from the first semiconductor layer to the second semiconductor layer,

wherein, in a region provided with the second sub light emitting unit, the third semiconductor layer is an outermost semiconductor layer, without being covered by any other semiconductor layers, in a direction from the first semiconductor layer to the third semiconductor layer, and

wherein in the second sub light emitting unit, the second semiconductor layer is between the first light emitting layer and the second light emitting layer and directly contacts each of the first light emitting layer and the second light emitting layer.

12. The manufacturing method of the light emitting diode device according to claim 11, further comprising:

etching the second semiconductor layer and the first light emitting layer of the first sub light emitting unit to expose a portion of the first semiconductor layer; and

etching the third semiconductor layer and the second light emitting layer of the second sub light emitting unit to expose a portion of the second semiconductor layer.

13. The manufacturing method of the light emitting diode device according to claim 12, further comprising:

in the first sub light emitting unit, forming a first electrode and a second electrode respectively on an exposed portion of the first semiconductor layer and the second semiconductor layer; and

in the second sub light emitting unit, forming a third electrode and a fourth electrode respectively on the third semiconductor layer and an exposed portion of the second semiconductor layer.

14. The manufacturing method of the light emitting diode device according to claim 13, wherein

the light emitting lamination layer further comprises a third light emitting layer and a fourth semiconductor layer with the second conductive type sequentially formed on the third semiconductor layer;

the light emitting unit further comprises a third area spaced apart from the first area and the second area; and

the manufacturing method further comprises;

completely removing the fourth semiconductor layer, the third light emitting layer, the third semiconductor layer, and the second light emitting layer in the first area to form the first sub light emitting unit;

completely removing the fourth semiconductor layer and the third light emitting layer in the second area to form the second sub light emitting unit; and

forming a third sub light emitting unit comprising the first semiconductor layer, the first light emitting layer, the second semiconductor layer, the second light emitting layer, the third semiconductor layer, the third light emitting layer, and the fourth semiconductor layer in the third area,

wherein in a region provided with the third sub light emitting unit, the fourth semiconductor layer is an outermost semiconductor layer in a direction from the first semiconductor layer to the fourth semiconductor layer.

15. The manufacturing method of the light emitting diode device according to claim 14, further comprising:

etching the fourth semiconductor layer and the third light emitting layer of the third sub light emitting unit to expose a portion of the third semiconductor layer.

16. The manufacturing method of the light emitting diode device according to claim 15, further comprising:

in the third sub light emitting unit, forming a fifth electrode and a sixth electrode respectively on an exposed portion of the third semiconductor layer and the fourth semiconductor layer.

17. The manufacturing method of the light emitting diode device according to claim 16, further comprising:

providing a substrate;

forming a plurality of contact electrodes insulated from each other on the substrate; and

bonding the light emitting unit to the substrate in an arrangement wherein the second semiconductor layer is closer to the substrate than is the first semiconductor layer, the light emitting unit being electrically connected with corresponding contact electrodes.

18. The manufacturing method of the light emitting diode device according to claim 13, further comprising:

providing a substrate;

forming a plurality of contact electrodes insulated from each other on the substrate; and

bonding the light emitting unit to the substrate in an arrangement wherein the second semiconductor layer is closer to the substrate than is the first semiconductor layer, the light emitting unit being electrically connected with corresponding contact electrodes.

19. The manufacturing method of the light emitting diode device according to claim 11, further comprising:

forming a buffer layer on the base substrate, wherein the forming the light emitting lamination layer on the base substrate comprises forming the light emitting lamination layer on the buffer layer.

20. The manufacturing method of the light emitting diode device according to claim 11, wherein the first sub light emitting unit does not comprise a layer provided in a same layer as the second light emitting layer, and the first sub light emitting unit does not comprise a layer provided in a same layer as the third semiconductor layer with the first conductive type.