Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member

• US 10,644,210 B2
• Filed: 03/31/2017
• Issued: 05/05/2020
• Est. Priority Date: 04/01/2016
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Marutani, Yukitoshi
• Primary Examiner(s): Kim, Jay C
• Application Number:
  US15/475,164
• Publication Number:
  US 20170288107A1
• Time in Patent Office: 1,131 Days
• Field of Search: 257 88
• CPC Class Codes: H01L 23/4922 having a heterogeneous or anisotropic structure
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/02315 Support members, e.g. bases or carriers
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips

Abstract

A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.

Claims

1. A light emitting element mounting base member comprising:

a first insulating member;

a plurality of electrical conductor cores;

a plurality of second insulating members, each of which has a reflectivity of 70% or more to light in a range of 440 nm to 630 nm and covers each of the plurality of electrical conductor cores; and

a light blocking resin that joins at least two of the plurality of second insulating members, the light blocking resin being capable of blocking 70% or more of the light in a range of 440 nm to 630 nm,

wherein the first insulating member is in contact with the light blocking resin, and

wherein at least one upper surface of the plurality of electrical conductor cores and at least one lower surface of the plurality of electrical conductor cores are exposed from the light blocking resin, and

wherein each of the plurality of electrical conductor cores is made of a partial sphere shape having a flat surface, each of the plurality of electrical conductor cores containing Cu and having an electrically conductive film formed thereon, the electrically conductive film containing Ni, Au, and Ag.

2. The light emitting element mounting base member according to claim 1, further comprising

a metal film on the at least one upper surface of the plurality of electrical conductor cores that are linearly arranged.

3. The light emitting element mounting base member according to claim 1,

wherein at least two of the plurality of electrical conductor cores are electrically connected by a metal film.

4. The light emitting element mounting base member according to claim 1,

wherein each of the plurality of electrical conductor cores is plated with glossy silver.

5. A light emitting device comprising:

a light emitting element mounting base member comprising;

a first insulating member;

a plurality of electrical conductor cores;

a plurality of second insulating members, each of which has a reflectivity of 70% or more to light in a range of 440 nm to 630 nm and covers each of the plurality of electrical conductor cores;

a light blocking resin that joins at least two of the plurality of second insulating members, the light blocking resin being capable of blocking 70% or more of the light in a range of 440 nm to 630 nm,

wherein the first insulating member is in contact with the light blocking resin,

wherein at least one upper surface of the plurality of electrical conductor cores and at least one lower surface of the plurality of electrical conductor cores are exposed from the light blocking resin, and

wherein each of the plurality of electrical conductor cores is made of a partial sphere shape having a flat surface, each of the plurality of electrical conductor cores containing Cu and having an electrically conductive film formed thereon, the electrically conductive film containing Ni, Au, and Ag; and

at least one light emitting element mounted on the light emitting element mounting base member and electrically connected to the electrical conductor cores.

6. The light emitting device according to claim 5,

wherein each of the at least one light emitting element includes positive and negative electrodes on a surface of the light emitting element closer to the light emitting element mounting base member, and at least two of the plurality of electrical conductor cores are electrically connected to the positive and negative electrodes of the light emitting element.

7. The light emitting device according to claim 5,

wherein the light emitting element mounting base member is configured such that the at least one light emitting element mounted thereon is disposed above one of the plurality of electrical conductor cores, the second insulating members, and the light blocking resin.

8. The light emitting device according to claim 5,

wherein the at least one light emitting element mounted on the light emitting element mounting base member is covered with an encapsulating member.

9. The light emitting element mounting base member according to claim 8,

wherein the encapsulating member is made of silicone resin or epoxy resin.

10. The light emitting element mounting base member according to claim 8,

wherein the encapsulating member is made of optical glass.