Array substrate, display panel and method for fabricating array substrate

• US 10,644,255 B2
• Filed: 08/31/2018
• Issued: 05/05/2020
• Est. Priority Date: 09/01/2017
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Hou, Wenjun
• Primary Examiner(s): Munoz, Andres
• Application Number:
  US16/118,637
• Publication Number:
  US 20190074475A1
• Time in Patent Office: 613 Days
• Field of Search: None
• CPC Class Codes: H10K 50/814 combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
• CPC Class Codes: H10K 50/824 combined with auxiliary electrodes
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/1315 comprising structures specially adapted for lowering the resistance
• CPC Class Codes: H10K 59/173 comprising banks or shadow masks
• CPC Class Codes: H10K 59/1795 comprising structures specially adapted for lowering the resistance
• CPC Class Codes: H10K 59/80522 combined with auxiliary electrodes
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The present disclosure relates to an array substrate, a method of fabricating the same, and a display panel. The array substrate includes a conductive layer formed on the base substrate, a dielectric layer formed on the conductive layer, wherein the dielectric layer has an opening exposing the conductive layer, wherein a vertical projection of the opening on the base substrate is in at least a portion of the pixel spacing region, a first electrode formed on the dielectric layer, a luminescent layer having a first portion on the first electrode and a second portion on the conductive layer in the opening, a second electrode formed on the luminescent layer, and an electrical connection portion in the second portion of the luminescent layer for providing an electrical connection from the conductive layer to the second electrode, and wherein the electrical connection portion is more conductive than the luminescent layer.

Claims

1. An array substrate comprising:

a conductive layer formed on a substrate;

a dielectric layer formed on the conductive layer, wherein the dielectric layer has an opening exposing the conductive layer, and wherein a vertical projection of the opening on the substrate is in at least a portion of a pixel spacing region;

a first electrode formed on the dielectric layer;

a luminescent layer having a first portion on the first electrode and a second portion on the conductive layer in the opening;

a second electrode formed on the luminescent layer; and

an electrical connection portion disposed in the second portion of the luminescent layer for providing an electrical connection between the conductive layer and the second electrode, wherein a conductivity of the electrical connection portion is greater than that of the luminescent layer.

2. The array substrate according to claim 1, wherein the electrical connection portion has a composite material comprising magnetic particles and a conductive polymer.

3. The array substrate according to claim 2, wherein the magnetic particles have a crowding level gradually increasing along a protruding direction of the electrical connection portion.

4. The array substrate according to claim 2, wherein the magnetic particles comprise at least one of a magnetic metal and an alloy thereof, and a magnetic oxide, and wherein the conductive polymer material comprises at least one of polypyrole, polyphenylene sulfide, polyphthalocyanine, polyaniline, and polythiophene.

5. The array substrate according to claim 2, wherein a projected area of a top part of the electrical connection portion on the surface of the substrate is smaller than that of a bottom part of the electrical connection portion on a surface of the substrate.

6. The array substrate according to claim 5, wherein the electrical connection portion has a slope angle ranging from about 75 to about 90 degrees.

7. The array substrate according to claim 1, further comprising a pixel defining layer defining the pixel spacing region, wherein the pixel defining layer has another opening in at least one portion of the pixel spacing region, and wherein the another opening of the pixel defining layer is aligned with the opening of the dielectric layer.

8. A display panel comprising the array substrate according to claim 1.

9. A method for fabricating an array substrate, the method comprising:

forming a conductive layer on a substrate;

forming a dielectric layer on the conductive layer, the dielectric layer having an opening exposing the conductive layer, a vertical projection of the opening of the dielectric layer on the substrate located in a pixel spacing region;

forming a first electrode on the dielectric layer;

forming an electrical connection portion in the opening of the dielectric layer;

forming a luminescent layer on the first electrode and in the opening of the dielectric layer, the luminescent layer having a first portion on the first electrode and a second portion in the opening, wherein a conductivity of the electrical connection portion is greater than that of the luminescent layer; and

forming a second electrode on the luminescent layer, wherein the electrical connection portion electrically connects the conductive layer to the second electrode.

10. The method for fabricating an array substrate according to claim 9, wherein the electrical connection portion has a composite material comprising magnetic particles and a conductive polymer.

11. The method for fabricating an array substrate according to claim 10, wherein the magnetic particles comprise at least one of a magnetic metal and an alloy thereof, and a magnetic oxide, and wherein the conductive polymer material comprises at least one of polypyrole, polyphenylene sulfide, polyphthalocyanine, polyaniline, and polythiophene.

12. The method for fabricating an array substrate according to claim 9, wherein forming the electrical connection portion comprises:

printing a composite material in the opening of the dielectric layer; and

drying the composite material to form the electrical connection portion in presence of a magnetic field, wherein the magnetic field causes magnetic particles of the composite material to have a crowding level gradually increasing along a protruding direction of the electrical connection portion.

13. The method for fabricating an array substrate according to claim 12, wherein a strength of the magnetic field ranges from 50 to 400 Gauss.

14. The method for fabricating an array substrate according to claim 9, wherein a projected area of a top part of the electrical connection portion on a surface of the substrate is smaller than that of a bottom of the electrical connection portion on the surface of the substrate.

15. The method for an array substrate according to claim 9, further comprising forming a pixel defining layer defining the pixel spacing region after forming the first electrode and before forming the electrical connection portion, wherein the pixel defining layer has another opening in the at least a portion of the pixel spacing region, and wherein the another opening of the pixel defining layer is aligned with the opening of the dielectric layer.