Package of electronic device and display panel

• US 10,644,259 B2
• Filed: 08/20/2018
• Issued: 05/05/2020
• Est. Priority Date: 08/18/2017
• Status: Active Grant

• Current Assignee: HannStar Display Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Wei, Hsiao-Fen, Chuang, Kun-Lin, Kuo, Yen-Ching
• Primary Examiner(s): Miller, Jami Valentine
• Application Number:
  US16/104,956
• Publication Number:
  US 20190058158A1
• Time in Patent Office: 624 Days
• Field of Search: 257 88
• CPC Class Codes: G02F 1/133311 Environmental protection, e.g. against dust or humidity
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

Claims

1. A package of electronic device comprising:

a substrate having a device area and a light transmitting area located outside the device area;

at least one electronic device disposed on the device area of the substrate; and

an encapsulation layer disposed on the substrate and covering the at least one electronic device, wherein the encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area.

2. The package of electronic device as claimed in claim 1, wherein the nitrogen content of the encapsulation layer on the device area is greater than or equal to 7 atomic percent (at %).

3. The package of electronic device as claimed in claim 1, wherein the encapsulation layer has a first nitrogen-rich area and a first oxygen-rich area, the first oxygen-rich area is located on the light transmitting area, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

4. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area, and the second nitrogen-rich area is located on the second oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

5. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the second nitrogen-rich area is located on the second oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

6. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second nitrogen-rich area is located near one side of the at least one electronic device, and the second nitrogen-rich area is located on the second oxygen-rich area.

7. The package of electronic device as claimed in claim 1, wherein the encapsulation layer has a first nitrogen-rich area and a first oxygen-rich area, the first oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

8. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area, and the second nitrogen-rich area is located on the second oxygen-rich area that is on device area or that is on both the device area and the light transmitting area.

9. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the second nitrogen-rich area is located on the second oxygen-rich area that is on the the device area or that is on both the device area and the light transmitting area.

10. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located near one side of the at least one electronic device, and the second nitrogen-rich area is located on the second oxygen-rich area.

11. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area located on the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and an oxygen-rich area, wherein the oxygen-rich area is located on the light transmitting area, and the second nitrogen-rich area is located on the oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

12. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area located on the device area and the light transmitting area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and an oxygen-rich area, wherein the oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the second nitrogen-rich area is located on the oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

13. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area, and the second nitrogen-rich area is located on the second oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

14. The package of electronic device as claimed in claim 1, wherein the encapsulation layer comprises:

a first barrier layer having a first nitrogen-rich area and a first oxygen-rich area, wherein the first oxygen-rich area is located near one side of the at least one electronic device, and the first nitrogen-rich area is located on the first oxygen-rich area; and

a second barrier layer disposed on the first barrier layer and having a second nitrogen-rich area and a second oxygen-rich area, wherein the second oxygen-rich area is located on the light transmitting area and the device area those are near one side of the at least one electronic device, and the second nitrogen-rich area is located on the second oxygen-rich area that is on the device area or that is on both the device area and the light transmitting area.

15. The package of electronic device as claimed in claim 1, further comprising a cover layer, wherein the cover layer is located between the at least one electronic device and the encapsulation layer.

18. A display panel comprising:

a display device comprising the package of electronic device as claimed in claim 1; and

a driving circuit correspondingly disposed on the device area and electrically connected to the display device.

19. The display panel as claimed in claim 18, further comprising a touch device, wherein the touch device is disposed on the display device.

20. The display panel as claimed in claim 19, further comprising a protective layer, wherein the protective layer is disposed on the touch device.

16. A package of electronic device comprising:

a substrate having a device area and a light transmitting area located outside the device area;

at least one electronic device disposed on the device area of the substrate; and

an encapsulation layer disposed on the substrate and covering the at least one electronic device, wherein a nitrogen content of the encapsulation layer on the device area is greater than or equal to 7 atomic percent (at %).

17. The package of electronic device as claimed in claim 16, further comprising a cover layer, wherein the cover layer is located between the at least one electronic device and the encapsulation layer.