Light source device

• US 10,644,477 B2
• Filed: 09/27/2018
• Issued: 05/05/2020
• Est. Priority Date: 09/28/2017
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Miyata, Tadaaki
• Primary Examiner(s): Neils, Peggy A
• Application Number:
  US16/144,316
• Publication Number:
  US 20190097381A1
• Time in Patent Office: 586 Days
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 7/0008 providing for indirect lighting
• CPC Class Codes: F21V 7/05 plane
• CPC Class Codes: F21Y 2115/30 Semiconductor lasers
• CPC Class Codes: H01S 5/02216 Butterfly-type, i.e. with electrode pins extending horizontally from the housings
• CPC Class Codes: H01S 5/0222 Gas-filled housings
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/02315 Support members, e.g. bases or carriers
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips
• CPC Class Codes: H01S 5/4031 Edge-emitting structures

Abstract

There is provided a light source device comprising a substrate; a semiconductor laser placed on the substrate; a side wall portion formed so as to surround the semiconductor laser; and a cover being translucent, configured to cover a space surrounded by the substrate and the side wall portion, wherein the side wall portion includes a lower surface connected to an upper surface of the substrate over a whole periphery, an upper surface connected to a lower surface of the cover over a whole periphery, and inner side surfaces inclined so that the space expands from a lower surface side to an upper surface side of the side wall portion, at least a part of the inner side surfaces serving as a reflection surface for reflecting a beam emitted from the semiconductor laser toward the cover, and a connecting portion where an upper surface of the substrate and a lower surface of the side wall portion are in contact with each other via a connecting layer is provided in a region corresponding to an upper surface of the side wall portion in a plan view from above.

Claims

1. A light source device comprising:

a substrate;

a semiconductor laser placed on the substrate;

a side wall portion formed so as to surround the semiconductor laser; and

a cover being translucent, configured to cover a space surrounded by the substrate and the side wall portion,

wherein

the side wall portion includes a lower surface connected to an upper surface of the substrate over a whole periphery, an upper surface connected to a lower surface of the cover over a whole periphery, and inner side surfaces inclined so that the space expands from a lower surface side to an upper surface side of the side wall portion, at least a part of the inner side surfaces serving as a reflection surface for reflecting a beam emitted from the semiconductor laser toward the cover,

a connecting portion where the upper surface of the substrate and the lower surface of the side wall portion are in contact with each other via a connecting layer is provided in a region corresponding to the upper surface of the side wall portion in a plan view from above, and adjacent to the connecting portion,

a recess is provided on at least one of the upper surface of the substrate and the lower surface of the side wall portion.

2. The light source device according to claim 1, wherein in a plan view from above, assuming that a distance between an end portion on a side of the inner side surfaces of the connecting portion and an end portion on a side of the inner side surfaces of a region where the upper surface of the side wall portion is positioned is L, and assuming that a height of the side wall portion is H1, a relationship of L/H1≤

0.4 is satisfied.

3. The light source device according to claim 2, wherein the connecting portion is provided only in a region where the upper surface of the side wall portion is positioned in a plan view from above.

4. The light source device according to claim 1, wherein the connecting layer is formed of a metal material, and the upper surface of the substrate and the lower surface of the side wall portion are connected by solid phase diffusion connection.

5. The light source device according to claim 1, wherein the recess is provided on the lower surface of the side wall portion.

6. The light source device according to claim 1, wherein a recessed amount of the recess is 1 μ

m or more and 20 μ

m or less.

7. The light source device according to claim 1, comprising a plurality of semiconductor lasers.

8. The light source device according to claim 1, wherein the side wall portion is formed of silicon.

9. The light source device according to claim 8, wherein the inclination angle of an inner side surface on which a beam emitted from the semiconductor laser is directly incident with respect to the upper surface of the substrate is different from an inclination angle of another inner side surface with respect to the upper surface of the substrate.

10. The light source device according to claim 1, wherein the substrate is formed of a ceramic material.

11. The light source device according to claim 1, wherein the inner side surface serving as the reflection surface is a <

111>

plane of single crystal silicon.

12. The light source device according to claim 1, wherein translucent glass is used as the material of the cover.

13. The light source device according to claim 1, wherein a reflection film containing silver (Ag) is formed on the reflection surface.

14. The light source device according to claim 1, wherein a reflection film containing aluminum (Al) is formed on the reflection surface.

15. The light source device according to claim 1, wherein a dielectric film is formed on the reflection surface.

16. The light source device according to claim 1, wherein a dielectric film is formed on the lower surface of the cover.

17. The light source device according to claim 4, wherein the metal material contains at least one of titanium (Ti), nickel (Ni), chromium (Cr), platinum (Pt) and gold (Au).

18. The light source device according to claim 4, wherein the metal material contains any one of titanium (Ti), nickel (Ni), chromium (Cr), platinum (Pt) and gold (Au).