Semiconductor device and method of manufacturing a semiconductor device
First Claim
1. A method for forming a packaged electronic device structure, comprising:
- providing a substrate having a major surface;
attaching a first device to the major surface of the substrate;
attaching a second device to the major surface spaced apart from the first device to provide a gap between the first device and the second device; and
forming a package body encapsulating a portion of the first device and a portion of the second device, wherein a side surface of the first device is exposed outside of the package body and the gap is devoid of the package body;
wherein;
the first device comprises a first semiconductor device, andthe second device comprises one of dummy device or a second semiconductor device.
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0 Petitions
Accused Products
Abstract
A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.
10 Citations
18 Claims
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1. A method for forming a packaged electronic device structure, comprising:
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providing a substrate having a major surface; attaching a first device to the major surface of the substrate; attaching a second device to the major surface spaced apart from the first device to provide a gap between the first device and the second device; and forming a package body encapsulating a portion of the first device and a portion of the second device, wherein a side surface of the first device is exposed outside of the package body and the gap is devoid of the package body; wherein; the first device comprises a first semiconductor device, and the second device comprises one of dummy device or a second semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A packaged semiconductor device structure, comprising:
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a substrate having a major surface; a semiconductor device connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface, wherein the semiconductor device comprises a laser device and the side surface of the semiconductor device includes an emitter region, a conductive interconnect structure electrically connecting the semiconductor device to the substrate; a protective material over the conductive interconnect structure, a portion of the laser device but not a side surface of the emitter region, and a least a portion of the first major surface of the substrate; and a lid structure attached to the substrate, the lid structure comprising sides, a top, and a singulated edge opening that exposes a side surface of the emitter region. - View Dependent Claims (12, 13, 14)
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15. A method for forming a packaged electronic device structure, comprising:
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providing a substrate having a major surface; attaching a semiconductor device to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface, wherein; the semiconductor device comprises a laser device, and the side surface of the semiconductor device comprises an emitter region; electrically connecting the semiconductor device to the substrate with a conductive interconnect structure; covering the conductive interconnect structure and at least a portion of the first major surface of the semiconductor device with a protective material; attaching a lid structure to the substrate, the lid structure comprising sides and a top; and removing a portion of the lid structure after attaching the lid structure to the substrate to provide an opening, wherein the side surface of the semiconductor device is exposed from of the lid structure through the opening. - View Dependent Claims (16, 17, 18)
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Specification