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Semiconductor device and method of manufacturing a semiconductor device

  • US 10,644,479 B1
  • Filed: 02/23/2019
  • Issued: 05/05/2020
  • Est. Priority Date: 02/23/2019
  • Status: Active Grant
First Claim
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1. A method for forming a packaged electronic device structure, comprising:

  • providing a substrate having a major surface;

    attaching a first device to the major surface of the substrate;

    attaching a second device to the major surface spaced apart from the first device to provide a gap between the first device and the second device; and

    forming a package body encapsulating a portion of the first device and a portion of the second device, wherein a side surface of the first device is exposed outside of the package body and the gap is devoid of the package body;

    wherein;

    the first device comprises a first semiconductor device, andthe second device comprises one of dummy device or a second semiconductor device.

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